Advanced Packaging Materials Engineer

Intel Corporation

Hillsboro (OR)

On-site

USD 115,000 - 220,000

Full time

14 days+

A complete application in a minute

Tailored resume and cover letter, ready to send.

Get past ATS filters

Benefits offered by this job

Competitive pay
Stock bonuses
Health benefits
Retirement plan
Vacation

Job summary

Intel Corporation seeks a motivated Materials Technology Development professional to advance packaging materials and processes. The role emphasizes cross‑functional collaboration, DOE knowledge, and delivering reliable materials solutions for next‑gen packaging.

The candidate will apply strong problem‑solving skills, work with suppliers, and drive optimization of materials, processes, and equipment to meet stringent quality and reliability targets. Onsite work is required.

Qualifications

  • Bachelor’s degree with 4+ years of experience or Master’s degree with 3+ years of experience or Ph.D in Materials Science, Metallurgy, Chemical Engineering, Chemistry, Mechanical Engineering, or related discipline.
  • 4+ years of hands‑on experience in packaging module development, process characterization, or equipment optimization.

Responsibilities

  • Develops assembly materials, processes and/or equipment and applies novel concepts for innovative solutions to enable Intel’s roadmap of future assembly packaging platform technologies.
  • Optimizes and improves the efficiency of manufacturing of packages, developing innovative materials, processes to meet quality, reliability, cost, yield, productivity and manufacturability requirements.
  • Develops process and equipment specifications applying DOE and data analysis; documents improvements through white papers.
  • Develops materials target specifications to ensure excellent integration of materials into packaging equipment and processes meeting quality and reliability targets.
  • Ensures manufacturability of physical layout of package design and oversees the cycle of manufactured package processes, procedures and flows.
  • Interfaces with supplier quality and procurement to meet material quality and vendor performance requirements.
  • Develops new techniques and acceleration methods, tools, and quality screens to identify potential problems early.

Skills

Materials Science
Metallurgy
Chemical Engineering
Chemistry
Mechanical Engineering

Education

Bachelor's degree
Master's degree
PhD

Tools

DOE
Statistical Analysis

Job description

Intel Corporation seeks a motivated Materials Technology Development professional to advance packaging materials and processes. The role emphasizes cross‑functional collaboration, DOE knowledge, and delivering reliable materials solutions for next‑gen packaging.

The candidate will apply strong problem‑solving skills, work with suppliers, and drive optimization of materials, processes, and equipment to meet stringent quality and reliability targets. Onsite work is required.

Get your free, confidential resume review.

or drag and drop your file here.

Similar jobs

Similar jobs worth comparing

Packaging Module Development Engineer
Packaging Module Development Engineer

Intel Corporation • Hillsboro (OR)

On-site
USD 115,000 - 220,000
Competitive pay
Stock bonuses
Health benefits
+2
Advanced Packaging Process Engineer – Semiconductors
Advanced Packaging Process Engineer – Semiconductors

Intel Corporation • Chandler (AZ)

On-site
USD 99,000 - 189,000
Advanced Packaging Process Engineer: Pathfinding & Innovation
Advanced Packaging Process Engineer: Pathfinding & Innovation

Intel Corporation • Hillsboro (OR)

On-site
USD 134,000 - 255,000
Senior Advanced Packaging Module Engineer
Senior Advanced Packaging Module Engineer

Intel Corporation • Hillsboro (OR)

On-site
USD 89,000 - 126,000
Stock bonuses
Health insurance
Retirement plan
+1
Advanced Packaging Module Engineer: Plating & Process Innovation
Advanced Packaging Module Engineer: Plating & Process Innovation

Intel Corporation • Hillsboro (OR)

On-site
USD 134,000 - 255,000
Stock bonuses
Health benefits
Retirement plan
+1
Packaging Process Development Engineer
Packaging Process Development Engineer

Intel Corporation • Chandler (AZ)

On-site
USD 99,000 - 189,000
Media & Collateral Packaging Engineer
Media & Collateral Packaging Engineer

Intel • Phoenix (AZ)

On-site
USD 85,000 - 120,000
Stock bonuses
Health benefits
Retirement plan
+1
Advanced Packaging Substrate Supplier Enablement Lead
Advanced Packaging Substrate Supplier Enablement Lead

Intel Corporation • Chandler (AZ)

On-site
USD 164,000 - 232,000
Stock bonuses
Health benefits
Retirement plan
+1
Head of Advanced Packaging Research & Integration
Head of Advanced Packaging Research & Integration

Intel Corporation • Chandler (AZ)

Hybrid
USD 221,000 - 312,000
Night-Shift Packaging Module Engineer (Semiconductors)
Night-Shift Packaging Module Engineer (Semiconductors)

Intel Corporation • Phoenix (AZ)

On-site
USD 85,000 - 163,000