Advanced Packaging Development Engineer

Intel Corporation; Chandler (AZ); Híbrido; USD 134.000 - 189.000; Jornada completa

Descripción de la vacante

Intel Corporation in Arizona seeks an experienced Packaging Module Development Engineer to design and optimize packaging processes, materials, and equipment for next‑generation semiconductor technologies. You will drive reliability, manufacturability, and performance in high‑volume manufacturing.

The role emphasizes collaboration across teams, statistical design of experiments (DOE), and process qualification, with documentation of findings and supplier coordination.

Formación

• Requires a STEM bachelor's degree with 3+ years' industry experience or advanced degrees as alternative paths.
• Experience in process development and/or equipment qualification for manufacturing applications.
• Preferred: experience leading technical teams and applying SPC/DOE and process characterization techniques.

Responsabilidades

• Develop, optimize, and qualify packaging assembly processes, materials, and equipment to meet quality, reliability, yield, and cost targets.
• Drive experimental design using SPC and DOE methodologies.
• Innovate techniques, materials, and tools to address packaging reliability and manufacturability challenges.
• Collaborate with cross-functional teams to mitigate risks and ensure product development success.
• Establish process specifications and material requirements with supplier collaboration.
• Document findings and improvements through reports and technical papers.
• Provide support for equipment performance and process health in development and high-volume manufacturing.

Conocimientos

Strong communication

Strong analytical

Educación

Bachelor's degree in Engineering/Physics/Chemistry

Master's degree in Engineering/Physics/Chemistry

PhD in Engineering/Physics/Chemistry

Herramientas

Python

MATLAB

SQL

Descripción del empleo

Job Details: Job Description: The Role and Impact As a Packaging Module Development Engineer, you will drive the design and optimization of innovative packaging processes and equipment essential to Intel's next-generation semiconductor technologies. Your day-to-day responsibilities will include developing solutions to enhance reliability, manufacturability, and performance in high-volume manufacturing environments. These contributions will play a critical role in advancing Intel's leadership in semiconductor packaging technologies.

Business Group This role is part of Intel Corporation's Advanced Packaging Technology Manufacturing (APTM) organization, which focuses on developing and scaling cutting-edge semiconductor packaging solutions. APTM supports Intel's broader mission by delivering technologies that empower high-performance, edge, and mobile computing applications, enabling global customer success and technological leadership.

Key Responsibilities

• Develop, optimize, and qualify packaging assembly processes, materials, and equipment to meet quality, reliability, yield, and cost targets.
• Drive experimental design using methodologies such as Statistical Process Control (SPC) and Design of Experiments (DOE).
• Innovate new techniques, materials, and tools to address emerging challenges in packaging reliability and manufacturability.
• Collaborate with cross-functional teams to mitigate technical risks and ensure product development success.
• Establish process specifications and material requirements while working with suppliers to meet stringent quality standards.
• Document technical findings, process improvements, and advancements through detailed reports and technical papers.
• Provide support for equipment performance and process health in both development and high-volume manufacturing environments.

Core Competencies

• Strong communication skills to collaborate across diverse teams and stakeholders.
• Strong analytical skills, including data analysis and risk assessment to inform decision-making.

Qualifications

Minimum Qualifications:

• Bachelor's degree in Engineering, Physics, Chemistry, or a related STEM field with 3+ years of industry experience.
• -OR- Master's degree in Engineering, Physics, Chemistry, or a related STEM field with 2+ years of industry experience.
• -OR- PhD in Engineering, Physics, Chemistry, or a related STEM field with no prior professional experience.
• Experience with process development and/or equipment qualification for manufacturing applications.

Preferred Qualifications

• Experience leading technical teams and collaborating across matrixed organizations to drive innovation.
• Experience in Statistical Process Control (SPC), Design of Experiments (DOE), and process characterization techniques.
• Experience with semiconductor fabrication processes, packaging flows, and assembly methodologies.
• Proven ability to deliver results in time-sensitive technical projects with a focus on process improvement.
• Knowledge of quality systems, documentation standards, and tools for packaging reliability evaluation.
• Proficiency in programming languages such as Python, MATLAB, or SQL to analyze complex datasets.

Join Intel's world-class technology development team and use your expertise to push the boundaries of innovation in semiconductor packaging.

Job Type

Experienced Hire

Shift

Shift 1 (United States of America)

Primary Location

US, Arizona, Phoenix

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

Annual Salary Range for jobs which could be performed in the US: $133,800.00-188,890.00 USD

The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training.

Work Model for this Role

This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site.

ADDITIONAL INFORMATION

Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.