Laser Packaging Process Engineer for Advanced Semiconductors

Intel Corporation

Chandler (AZ)

On-site

USD 85,000 - 163,000

Full time

2 days ago

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Benefits offered by this job

Stock bonuses

Health benefits

Retirement plan

Vacation

Job summary

Intel is seeking a Packaging Module Development Engineer in Laser Assembly based in Phoenix, AZ. You will shape next-generation laser packaging processes and equipment to enhance performance, reliability, and yield across Intel's assembly and packaging solutions.

The role requires strong skills in SPC/DOE, laser and optical systems, and collaboration with cross-functional teams. This college-grad position emphasizes hands-on development and rapid contribution in a fast-paced environment.

Qualifications

Bachelor's or Master's in Physics, Mechanical or Optical Engineering or related STEM field.
Proficiency in SPC and DOE principles.
Fundamental understanding of laser and optical systems.

Responsibilities

Design and develop laser assembly packaging processes and equipment.
Optimize manufacturing processes for quality, cost, yield and productivity.
Develop DOE-based process specifications and analyze data.
Oversee manufacturability of layout designs and full packaging process lifecycle.
Set laser process specifications and coordinate with suppliers.
Innovate techniques, tools, and quality screening for early issue detection.
Drive standardization of qualification procedures and quality systems.