Night Shift Module Engineer – Semiconductor Packaging

Intel Corporation

Chandler (AZ)

On-site

USD 99,000 - 140,000

Full time

14 days+

Get a reply from this employer

Your resume and cover letter, tailored to exactly what they’re hiring for.

Get past ATS filters

Benefits offered by this job

Stock bonuses
Health benefits
Retirement plan
Vacation

Job summary

Intel Corporation in Chandler, Arizona, is seeking a Module Engineer On Shift (MEOS) for its Substrate Packaging Technology Development (SPTD) team. You will support a 24x7 manufacturing line on the factory floor, addressing equipment and process issues and ensuring smooth lot movement.

The role requires strong problem-solving and communication skills, adaptability, and initiative. The position is on-site in Arizona with competitive compensation and benefits.

Qualifications

  • Bachelor's degree in a materials/engineering discipline with 1+ years of relevant industry experience or a Master’s degree.
  • Preferred qualifications include SPC methodologies and packaging experience.

Responsibilities

  • Provide hands-on, real-time support for equipment, process, and product issues on the factory floor.
  • Receive and deliver comprehensive pass-downs to ensure alignment with the outgoing/incoming shift teams.
  • Respond to process issues, perform error recovery, manage lot disposition, and support new tool enabling activities.
  • Write and update specifications and RFCs to maintain accurate process records.
  • Conduct inspection and imaging on panels to collect critical development data.
  • Communicate key issues to Tool and Lot Owners via email for timely resolution.
  • Perform ad-hoc duties as required by the factory.

Skills

Problem solving
Communication
Adaptability
Initiative
Teamwork

Education

Bachelor's degree in Materials/Mechanical/Chemical Engineering, Physics or related
Master’s degree in Materials/Mechanical/Chemical Engineering, Physics or related

Job description

Intel Corporation in Chandler, Arizona, is seeking a Module Engineer On Shift (MEOS) for its Substrate Packaging Technology Development (SPTD) team. You will support a 24x7 manufacturing line on the factory floor, addressing equipment and process issues and ensuring smooth lot movement.

The role requires strong problem-solving and communication skills, adaptability, and initiative. The position is on-site in Arizona with competitive compensation and benefits.

Get your free, confidential resume review.

or drag and drop your file here.

Similar jobs

Similar jobs worth comparing

Night Shift Module Engineer — 24x7 Packaging Ops
Night Shift Module Engineer — 24x7 Packaging Ops

Intel • Phoenix (AZ)

On-site
USD 99,000 - 140,000
Stock bonuses
Health benefits
Retirement plan
+1
Night-Shift Module Engineer — Semiconductor Packaging
Night-Shift Module Engineer — Semiconductor Packaging

Intel Corporation • Chandler (AZ)

On-site
USD 99,000 - 140,000
Stock bonuses
Health benefits
Vacation
Night-Shift Module Engineer: Real-Time Floor Support
Night-Shift Module Engineer: Real-Time Floor Support

Intel • Phoenix (AZ)

On-site
USD 85,000 - 140,000
Stock bonuses
Health benefits
Retirement plan
+1
Module Engineer – Day Shift: Real-Time Floor Support
Module Engineer – Day Shift: Real-Time Floor Support

Intel • Phoenix (AZ)

On-site
USD 99,000 - 140,000
Stock bonuses
Health benefits
Vacation
+1
Night Shift Engineering Manager - Substrates & Packaging
Night Shift Engineering Manager - Substrates & Packaging

Intel Corporation • Chandler (AZ)

On-site
USD 115,000 - 220,000
Stock bonuses
Health benefits
Vacation
+1
Night Shift Module Engineer – Packaging & Reliability
Night Shift Module Engineer – Packaging & Reliability

Intel Corporation • Phoenix (AZ)

On-site
USD 99,030 - 139,810
Stock bonuses
Health benefits
Retirement plan
+1
Module Engineer On-Shift (MEOS) – Night Shift (4)
Module Engineer On-Shift (MEOS) – Night Shift (4)

Intel • Phoenix (AZ)

On-site
USD 85,000 - 140,000
Stock bonuses
Health benefits
Retirement plan
+1
Module Engineer On-Shift (MEOS) – Night Shift (4)
Module Engineer On-Shift (MEOS) – Night Shift (4)

Intel Corporation • Phoenix (AZ)

Hybrid
USD 85,000 - 140,000
Competitive pay and bonuses
Stock options
Health, retirement, and vacation plans
Module Engineer On-Shift (MEOS) – Day Shift (5)
Module Engineer On-Shift (MEOS) – Day Shift (5)

Intel • Phoenix (AZ)

On-site
USD 99,000 - 140,000
Stock bonuses
Health benefits
Vacation
+1
Module Engineer On-Shift (MEOS) – Day Shift (7)
Module Engineer On-Shift (MEOS) – Day Shift (7)

Intel Corporation • Phoenix (AZ)

On-site
USD 85,000 - 163,000
Health insurance
Retirement plan
Paid time off