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Intel Corporation is seeking a Module Engineer On Shift (MEOS) to join the Substrate Packaging Technology Development team in Chandler, Arizona. You will provide real-time floor support for equipment and process issues on a 6 PM–6 AM night shift, collaborating with engineers and technicians to keep 24x7 lot movement smooth.
The role requires a Bachelor’s or Master’s in a related engineering field and hands-on packaging/substrate experience.
Intel Corporation is seeking a Module Engineer On Shift (MEOS) to join the Substrate Packaging Technology Development team in Chandler, Arizona. You will provide real-time floor support for equipment and process issues on a 6 PM–6 AM night shift, collaborating with engineers and technicians to keep 24x7 lot movement smooth.
The role requires a Bachelor’s or Master’s in a related engineering field and hands-on packaging/substrate experience.