Senior Advanced Packaging Module Engineer

Intel Corporation; Hillsboro, Northern (OR, KY); Hybrid; USD 134,000 - 255,000; Full time

Benefits offered by this job

Stock bonuses

Health benefits

Job summary

Intel Corporation in Hillsboro, Oregon seeks an Advanced Packaging Module Development Engineer to drive technology development for high-volume manufacturing and next-generation devices. You will lead design and development of sophisticated manufacturing processes, work with suppliers, and build roadmaps for future product generations.

The role emphasizes SPC/DOE, robotics and automation, and cross-functional collaboration across engineering teams.

Qualifications

• Master's degree with 4+ years of relevant experience, or PhD with 3+ years.
• Technical expertise in semiconductor processing, system controls, opto-mechanics, or mechanical systems.
• Hands-on experience with robotics, automation systems, vision systems, or image processing.
• 4+ years of SPC and DOE; programming in Python or MATLAB; troubleshooting complex manufacturing processes.

Responsibilities

• Drive technology development for high-volume manufacturing and future technology nodes with process integration and equipment solutions.
• Lead design and development of sophisticated manufacturing processes, including materials, parameters, and metrology.
• Perform pathfinding activities and develop technology roadmaps for future product generations.
• Recommend and implement modifications to equipment to improve production efficiency and output.
• Collaborate with suppliers to develop enabling elements and cost-sensitive roadmaps.
• Conduct feasibility studies through simulations and practical engineering methods.
• Stay current on industrial process and material trends to guide Intel's future needs.
• Apply SPC and DOE to drive data-informed decisions and process improvements.
• Leverage robotics, automation, vision systems, and image processing to advance capabilities.

Skills

Semiconductor processing

Robotics

Automation systems

Vision systems

Image processing

Python

MATLAB

DOE / SPC

Education

Master's degree in Materials Science and Engineering, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Physics, Chemistry, or related field

PhD in the same fields

Job description

Intel Corporation in Hillsboro, Oregon seeks an Advanced Packaging Module Development Engineer to drive technology development for high-volume manufacturing and next-generation devices. You will lead design and development of sophisticated manufacturing processes, work with suppliers, and build roadmaps for future product generations.

The role emphasizes SPC/DOE, robotics and automation, and cross-functional collaboration across engineering teams.