Lead Packaging Plating & Module Engineer

Intel Corporation; Oregon; On-site; USD 134,000 - 255,000; Full time

Benefits offered by this job

Competitive pay and stock bonuses

Health, retirement, and vacation benefi

Intel culture and growth opportunities

Job summary

Intel Corporation in Hillsboro, Oregon is seeking a Module Development Engineer to advance semiconductor manufacturing capabilities by developing and optimizing processes for next-generation devices, conducting feasibility studies, and enabling high-volume production.

You will collaborate across teams, use SPC and data analytics, and drive process innovations, with a Master's/PhD plus 2–4 years in semiconductor processing; on-site work model.

Qualifications

• Master's or PhD in STEM with relevant experience.
• 2+ years in semiconductor processing or advanced packaging.
• Experience with SPC or manufacturing process improvements.

Responsibilities

• Develop and optimize advanced manufacturing processes, including metrology and system design.
• Conduct feasibility studies and simulations to meet device specs.
• Drive process innovation for next-generation semiconductor architectures.
• Collaborate with suppliers to design and implement innovative process technologies.
• Develop technology roadmaps to guide future manufacturing needs.
• Monitor production efficiency and suggest scalability improvements.
• Utilize SPC and data analytics to ensure process stability.
• Partner with cross-functional teams on process integration and deliverables.

Skills

Cross-functional collaboration

Project leadership

Analytical mindset

Education

Master's degree in Materials Science, Electrical Engineering, Mechanical Engineering, Chemical Engineering, Physics, or Chemistry

PhD in related STEM fields (with 2+ years experience)

Tools

Plasma etch

Thin-film deposition

Wafer-level assembly

Job description

Intel Corporation in Hillsboro, Oregon is seeking a Module Development Engineer to advance semiconductor manufacturing capabilities by developing and optimizing processes for next-generation devices, conducting feasibility studies, and enabling high-volume production.

You will collaborate across teams, use SPC and data analytics, and drive process innovations, with a Master's/PhD plus 2–4 years in semiconductor processing; on-site work model.