MS ASIC Package Eng Co-op/Intern - Hybrid

Advanced Micro Devices; United States; Hybrid; USD 25,000 - 44,000; Full time

Benefits offered by this job

AMD benefits at a glance

Job summary

Advanced Micro Devices is seeking a highly motivated ASIC Package Engineering intern/co-op to join our team in bringing advanced packaging technology to reality. You will work with engineers to prioritize projects, train on substrate/interposer/bump designs, and support design verification efforts while learning from experts in a dynamic AI-enabled ecosystem.

The role emphasizes hands-on design work, yield analysis, material benchmarking, and collaboration with partners to optimize cost and

Qualifications

• Currently enrolled in a US-based university in a Masters degree program majoring in Electrical engineering, Engineering Science, Computer Engineering, Mechanical Engineering, Material Science Engineering, or a related field.
• Knowledge or experience with transmission lines and electric circuits is a plus.
• Experience with package, silicon or PCB design software preferred.
• Scripting languages – Perl / Python / SQL recommended.
• Semiconductor theory and packaging process/technology knowledge is beneficial.
• Data analytics and data visualization tools like PowerBI are encouraged.

Responsibilities

• Support Package design and Package Development Engineers in prioritizing and optimizing new projects.
• Assist in completing substrate, interposer and bump designs for AMD products, test vehicles and probe card substrates.
• Contribute to design verification implementation to ensure performance, quality and efficiency.
• Analyze yield and defect metrics to improve design performance and yield.
• Evaluate and benchmark packaging materials and interact with partners to achieve cost-efficient designs and materials.

Skills

Electrical engineering

Python

PowerBI

Education

Master's degree program in Electrical/Engineering

Tools

Package design software

PCB design software

Job description

Advanced Micro Devices is seeking a highly motivated ASIC Package Engineering intern/co-op to join our team in bringing advanced packaging technology to reality. You will work with engineers to prioritize projects, train on substrate/interposer/bump designs, and support design verification efforts while learning from experts in a dynamic AI-enabled ecosystem.

The role emphasizes hands-on design work, yield analysis, material benchmarking, and collaboration with partners to optimize cost and