ASIC Packaging Design Intern (Co-op)

Advanced Micro Devices; Austin (TX); Hybrid; USD 2.755.000 - 4.684.000; Vollzeit

Zusammenfassung

Advanced Micro Devices is seeking a highly motivated ASIC Package Engineering intern/co-op to join our team in Austin, TX or Boxborough, MA. You will work full time in a hybrid or onsite structure for the co-op/intern term.

As a student in Electrical, Computer, or Mechanical Engineering (or related fields), you will assist with substrate, interposer and bump design, design verification, and yield analysis while collaborating with experienced engineers on real AMD products.

Qualifikationen

• Enrolled in a US-based university in an engineering Bachelor's degree program.
• Knowledge of packaging design software and scripting languages is preferred.
• Interest in ASIC packaging technology and collaboration with experienced engineers.

Aufgaben

• Support Package design and Package Development Engineers in prioritizing and optimizing projects.
• Assist with substrate, interposer and bump designs for AMD products and test vehicles.
• Contribute to design verification to ensure performance and quality.
• Analyze yield and defect metrics to improve yield and performance.
• Evaluate packaging materials and interact with partners for cost-efficient designs.

Kenntnisse

Analytical thinking

Data analytics

Data visualization

Ausbildung

Bachelor's degree program in Electrical Engineering or related field (Engineering Science, Computer Engineering, Mechanical Engineering, Material Science Engineering)

Tools

Package design software

Silicon design software

PCB design software

Perl

Python

SQL

PowerBI

Jobbeschreibung

Advanced Micro Devices is seeking a highly motivated ASIC Package Engineering intern/co-op to join our team in Austin, TX or Boxborough, MA. You will work full time in a hybrid or onsite structure for the co-op/intern term.

As a student in Electrical, Computer, or Mechanical Engineering (or related fields), you will assist with substrate, interposer and bump design, design verification, and yield analysis while collaborating with experienced engineers on real AMD products.