Masters ASIC Package Eng Intern/Co-op (Hybrid/Onsite)

Advanced Micro Devices, Inc.; Santa Clara (CA); Hybrid; USD 28,000 - 34,000; Full time

Job summary

AMD invites driven MS students in Electrical/Computer Engineering to join as ASIC Package Engineering intern/co-op, working with a team of engineers on packaging technology and verification.

You will participate in substrate, interposer, and bump design, learn testing, and contribute to cost-efficient materials for performance. This internship is based in San Jose/Santa Clara with full-time hours in hybrid or onsite settings.

Qualifications

• Must be enrolled in a US-based university pursuing a Masters degree in a relevant engineering field.
• Coursework in transmission lines and electric circuits is a plus.
• Familiarity with data analytics and visualization tools like PowerBI is encouraged.

Responsibilities

• Support package design and development engineers in prioritizing and optimizing new projects.
• Assist in creating substrate, interposer, and bump designs for AMD products and test vehicles.
• Contribute to design verification implementation to ensure performance and quality.
• Analyze yield and defect metrics to drive improvements in design and yield.
• Evaluate packaging materials and interact with partners to optimize cost and performance.

Skills

Data analytics

PowerBI

Scripting languages (Perl/Python/SQL)

Package/PCB design software

Education

Master's degree in Electrical Engineering, Engineering Science, Computer Engineering, Mechanical Engineering, or related field

Tools

Package design software

Job description

AMD invites driven MS students in Electrical/Computer Engineering to join as ASIC Package Engineering intern/co-op, working with a team of engineers on packaging technology and verification.

You will participate in substrate, interposer, and bump design, learn testing, and contribute to cost-efficient materials for performance. This internship is based in San Jose/Santa Clara with full-time hours in hybrid or onsite settings.