ASIC Packaging Engineering Intern

Advanced Micro Devices, Inc.; Austin (TX); Hybrid; USD 20,000 - 33,000; Full time

Job summary

Advanced Micro Devices, Inc. (AMD) is seeking a highly motivated ASIC Package Engineering intern/co-op. You will join a team of engineers working on new packaging technology, supporting design and development, and contributing to yield improvements.

You will gain hands-on experience with substrate, interposer and bump designs, design verification, and interaction with partners to optimize cost and performance. This internship offers real-world impact and networking opportunities.

Qualifications

• Enrolled in a US-based university in a Bachelor’s degree program (Electrical/Engineering).
• Knowledge or experience with package design software, PCB design software, and scripting languages (Perl, Python, SQL).
• Exposure to data analytics and data visualization tools like PowerBI.

Responsibilities

• Support Package design and Package Development Engineers in prioritizing and optimizing new projects.
• Assist with substrate, interposer and bump designs for AMD products, test vehicles and probe card substrates.
• Contribute to design verification implementation to ensure performance and efficiency.
• Analyze yield and defect metrics to improve design performance.
• Evaluate and benchmark packaging materials; interact with partners for cost-efficient design and materials.

Skills

Perl/Python/SQL

PowerBI

Package design software

PCB design software

Transmission lines/electric circuits

Education

Bachelor's in Electrical Engineering / related field

Tools

PowerBI

Job description

Advanced Micro Devices, Inc. (AMD) is seeking a highly motivated ASIC Package Engineering intern/co-op. You will join a team of engineers working on new packaging technology, supporting design and development, and contributing to yield improvements.

You will gain hands-on experience with substrate, interposer and bump designs, design verification, and interaction with partners to optimize cost and performance. This internship offers real-world impact and networking opportunities.