ASIC Package Eng Intern — Hybrid, Design & Yield

Advanced Micro Devices; United States; Hybrid; USD 28,000 - 44,000; Full time

Job summary

Advanced Micro Devices (AMD) is seeking an ASIC Package Engineering intern/co-op to join our team in bringing advanced packaging technology to reality. You’ll work with engineers on substrate, interposer and bump designs for AMD products and test vehicles.

You will learn design verification, analyze yield metrics, and evaluate packaging materials with partners to optimize cost and performance. This internship offers hands-on experience at the core of AI and semiconductor innovation.

Qualifications

• Pursuing a US-based Bachelor's degree in a relevant engineering field.
• Knowledge of scripting languages (Perl, Python, SQL) encouraged.
• Familiarity with package, silicon or PCB design software desired.

Responsibilities

• Support package design and package development engineers in prioritizing and optimizing new projects.
• Assist in designing substrates, interposers, and bump designs for AMD products and test vehicles.
• Contribute to design verification to ensure performance and quality.
• Analyze yield and defect metrics to improve design yield.
• Evaluate packaging materials and work with partners for cost-effective designs.

Skills

Perl

Python

SQL

Education

Bachelors in Electrical Eng / Eng Science / Computer Eng / Mechanical Eng / Materials Science Eng

Tools

Package design software

Silicon design software

PCB design software

Job description

Advanced Micro Devices (AMD) is seeking an ASIC Package Engineering intern/co-op to join our team in bringing advanced packaging technology to reality. You’ll work with engineers on substrate, interposer and bump designs for AMD products and test vehicles.

You will learn design verification, analyze yield metrics, and evaluate packaging materials with partners to optimize cost and performance. This internship offers hands-on experience at the core of AI and semiconductor innovation.