ASIC Packaging Engineer Intern

AMD; Austin (TX); Hybrid; USD 39,000 - 55,000; Full time

Job summary

AMD is seeking a highly motivated ASIC Package Engineering intern/co-op in Austin, TX to join our AI ecosystem. You will work full time in a hybrid or onsite setup during the term and gain real-world experience on cutting-edge packaging projects that impact millions of end-users.

You will assist with package design and development, learn substrate, interposer, and bump design, participate in design verification, analyze yield, and help benchmark materials for best performance and yield.

Qualifications

• Currently enrolled in a US university pursuing a Bachelor's degree in EE, Engineering Science, CE, ME, or related field.
• Coursework related to transmission lines, circuits, or packaging.
• Experience or familiarity with data analytics and Power BI encouraged.

Responsibilities

• Support package design and development activities with Design Engineers.
• Train to complete substrate, interposer, and bump designs for AMD products and test vehicles.
• Participate in design verification to ensure performance, quality and efficiency.
• Analyze yield and defect metrics to improve design performance and yield.
• Evaluate and benchmark packaging materials with partners for cost-efficient, high-performance designs.

Skills

Transmission lines

PCB design software

Perl/Python/SQL

Semiconductor packaging

Power BI

Education

Bachelor's degree in Electrical Engineering / CE / ME / related field

Job description

AMD is seeking a highly motivated ASIC Package Engineering intern/co-op in Austin, TX to join our AI ecosystem. You will work full time in a hybrid or onsite setup during the term and gain real-world experience on cutting-edge packaging projects that impact millions of end-users.

You will assist with package design and development, learn substrate, interposer, and bump design, participate in design verification, analyze yield, and help benchmark materials for best performance and yield.