ASIC Package Eng Co-op — Innovate Packaging Design

AMD; Secaucus (NJ); Hybrid; USD 28,000 - 44,000; Full time

Job summary

AMD is seeking a highly motivated ASIC Package Engineering intern/co‑op to join our team and contribute to advanced packaging technology. You will work with engineers on substrate, interposer and bump designs and support design verification to ensure performance and yield.

You must be enrolled in a US university pursuing a Bachelor's in Electrical, Computer, Mechanical or Materials Science engineering or related field, with interest in packaging, design software, scripting and data analytics.

Qualifications

• Currently enrolled in a US-based university pursuing a Bachelor's degree in Electrical Engineering, Engineering Science, Computer Engineering, Mechanical Engineering, Materials Science Engineering, or a related field.
• Knowledge of transmission lines and electric circuits.
• Familiarity with package, silicon or PCB design software.
• Scripting languages – Perl / Python / SQL.
• Semiconductor theory and packaging process/technology.
• Data analytics and data visualization tools like Power BI.

Responsibilities

• We will have your involvement in supporting Package design and Package Development Engineers in prioritizing and optimizing new projects
• We will train you to complete substrate, interposer and bump designs for AMD products, test vehicles and probe card substrates
• We will assign you projects related to design verification implementation to ensure design performance, quality and efficiency
• Analyzing yield and defect metrics to ensure design performance and help improve the yield will be part of your responsibilities
• We will encourage you to evaluate, benchmark packaging materials and interact with partners to achieve the most cost-efficient design and materials for the best performance and yield requirements

Skills

Transmission lines

Electric circuits

Scripting languages

Semiconductor theory

Data analytics

Education

Bachelor's degree in Electrical Engineering or related

Tools

PCB design software

Package design software

Power BI

Job description

AMD is seeking a highly motivated ASIC Package Engineering intern/co‑op to join our team and contribute to advanced packaging technology. You will work with engineers on substrate, interposer and bump designs and support design verification to ensure performance and yield.

You must be enrolled in a US university pursuing a Bachelor's in Electrical, Computer, Mechanical or Materials Science engineering or related field, with interest in packaging, design software, scripting and data analytics.