Aspiring ASIC Package Engineer Co-op 2027

AMD; Town of Fishkill (NY); Hybrid; USD 28,000 - 41,000; Full time

Benefits offered by this job

Benefits at a glance

Job summary

AMD is seeking a highly motivated ASIC Package Engineering intern/co‑op. You will join a team bringing advanced packaging technology to reality, involved in substrate, interposer, and bump design for AMD products.

You will learn design verification, yield analysis, and benchmarking packaging materials, working with partners to meet performance and cost targets. This internship offers real-world experience across multiple packaging domains.

Qualifications

• Enrolled in a US-based university for a masters in a relevant engineering field.
• Strong interest in ASIC packaging, substrates, and test vehicles.
• Coursework or projects in packaging, electronics or data analytics welcomed.

Responsibilities

• Assist in package design and development tasks for AMD products.
• Support substrate, interposer and bump design activities for test vehicles.
• Contribute to design verification and yield performance analysis.
• Analyze yield metrics and help identify failure sources and improvements.
• Benchmark packaging materials and collaborate with partners for cost‑effective designs.

Skills

Python

PowerBI

Scripting (Perl/SQL)

Education

Master's degree in Electrical Engineering or related field

Tools

Package design software

PCB design software

ECAD tools

Job description

AMD is seeking a highly motivated ASIC Package Engineering intern/co‑op. You will join a team bringing advanced packaging technology to reality, involved in substrate, interposer, and bump design for AMD products.

You will learn design verification, yield analysis, and benchmarking packaging materials, working with partners to meet performance and cost targets. This internship offers real-world experience across multiple packaging domains.