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AMD is seeking a highly motivated ASIC Package Engineering intern/co-op in San Jose for a hands-on experience in packaging technology. You will work with a team of engineers to bring new packaging solutions to reality and learn to support substrate, interposer, and bump designs for AMD products.
You will analyze yield, assist design verification, and benchmark materials while collaborating with partners to achieve cost-efficient performance. The role is onsite/hybrid for a full-time duration.
AMD is seeking a highly motivated ASIC Package Engineering intern/co-op in San Jose for a hands-on experience in packaging technology. You will work with a team of engineers to bring new packaging solutions to reality and learn to support substrate, interposer, and bump designs for AMD products.
You will analyze yield, assist design verification, and benchmark materials while collaborating with partners to achieve cost-efficient performance. The role is onsite/hybrid for a full-time duration.