Masters ASIC Package Engineer Co-op/Intern

AMD; Boxborough (MA); Hybrid; USD 30,000 - 39,000; Full time

Job summary

AMD is seeking a highly motivated ASIC Package Engineering intern/co-op in the US. You will work with a team of engineers to advance packaging technology for AMD products, from substrate to probe cards, and contribute to design verification and yield improvements.

You must be enrolled in a US university with a Master’s in Electrical/Computer/Mechanical/Material science engineering or related field. This role is 40 hours a week, hybrid or onsite.

Qualifications

• Enrollment in a US university for a Master’s degree in a relevant field.
• Knowledge of substrate, interposer, and packaging concepts is a plus.
• Proficiency with scripting languages such as Perl, Python or SQL.

Responsibilities

• Assist in packaging design and development, prioritizing new projects.
• Learn substrate, interposer, and bump designs for AMD products.
• Support design verification to ensure performance and quality.
• Analyze yield and defects to help improve design outcomes.
• Evaluate packaging materials and coordinate with partners for cost efficiency.

Skills

Electrical engineering

Package design software

Perl

Python

SQL

Power BI

Education

Master's in Electrical engineering or related field

Tools

Power BI

Job description

AMD is seeking a highly motivated ASIC Package Engineering intern/co-op in the US. You will work with a team of engineers to advance packaging technology for AMD products, from substrate to probe cards, and contribute to design verification and yield improvements.

You must be enrolled in a US university with a Master’s in Electrical/Computer/Mechanical/Material science engineering or related field. This role is 40 hours a week, hybrid or onsite.