Aspiring ASIC Packaging Engineer Co-op/Intern

AMD

Longmont (CO)

Hybrid

USD 25,000 - 39,000

Full time

8 days ago

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Job summary

AMD is seeking a highly motivated ASIC Package Engineering intern/co-op. You will join a team of engineers bringing advanced packaging technology to reality, working across substrate, interposer, and bump designs, and contributing to design verification and yield analysis.

The role involves training in substrate and package design, evaluating materials, and interfacing with partners to optimize performance and cost.

Qualifications

Enrolled in a US-based university in a Masters degree program in Electrical Engineering, Engineering Science, Computer Engineering, Mechanical Engineering, Material Science Engineering, or a related field.
Knowledge of transmission lines and electric circuits is preferred.
Familiarity with package, silicon or PCB design software.
Scripting languages include Perl, Python, or SQL.
Understanding of semiconductor theory and packaging processes/technology; data analytics and PowerBI desirable.

Responsibilities

Support package design and package development engineers by prioritizing and optimizing new projects.
Assist in designing substrates, interposers, and bump designs for AMD products and test vehicles.
Contribute to design verification efforts to ensure performance, quality, and efficiency.
Analyze yield and defect metrics to improve design performance and yield.
Evaluate packaging materials and coordinate with partners to achieve cost-efficient designs.