ASIC Package Eng Intern — Innovate Packaging Design

AMD; Fort Collins (CO); Hybrid; USD 28,000 - 39,000; Full time

Job summary

AMD is seeking an ASIC Packaging intern/co-op in Fort Collins as part of its co-op/intern program. You will work with a team of engineers on advancing packaging technology and bring new AMD products toward reality.

This role is designed for a US-based Master’s student in related fields and involves hands-on design work. Responsibilities include supporting package design, substrate and bump design, design verification, and yield analysis.

Qualifications

• Pursuing a US-based Master's degree in a relevant engineering field.
• Experience with ASIC packaging concepts is a plus.
• Familiarity with data analytics tools like Power BI.

Responsibilities

• Support Package design and Package Development Engineers in prioritizing and optimizing new projects.
• Learn to complete substrate, interposer and bump designs for AMD products, test vehicles, and probe card substrates.
• Contribute to design verification initiatives to ensure performance, quality and efficiency.
• Analyze yield and defect metrics to improve design performance and yield.
• Evaluate and benchmark packaging materials; interact with partners for cost-efficient design and yield.

Skills

Electrical engineering

Engineering Science

Computer Engineering

Mechanical Engineering

Material Science Engineering

Power BI

Education

Master's degree in Electrical Engineering or related field

Tools

Package design software

Substrate design software

Perl

Python

SQL

Job description

AMD is seeking an ASIC Packaging intern/co-op in Fort Collins as part of its co-op/intern program. You will work with a team of engineers on advancing packaging technology and bring new AMD products toward reality.

This role is designed for a US-based Master’s student in related fields and involves hands-on design work. Responsibilities include supporting package design, substrate and bump design, design verification, and yield analysis.