Masters ASIC Package Eng Intern/Co-op

AMD; Secaucus (NJ); Hybrid; USD 27,552,000 - 41,328,000; Full time

Benefits offered by this job

AMD Benefits at a glance

Job summary

AMD invites motivated students to join as ASIC Package Engineering interns or co-ops. You will work with engineers to bring new packaging technologies to life and gain real-world experience on projects impacting millions of end-users worldwide.

Open to undergraduates or PhD students currently enrolled in a US-based university, this program offers hands-on training, team collaboration, and exposure to next-generation packaging solutions, with hybrid or onsite work options.

Qualifications

• Currently enrolled in a US-based university in a Master’s program in Electrical Engineering, Engineering Science, Computer Engineering, Mechanical Engineering, or a related field.
• Familiarity with transmission lines and electric circuits is preferred.
• Experience with package, silicon or PCB design software and data analytics tools like PowerBI is a plus.

Responsibilities

• Support ASIC package design and development tasks for AMD products.
• Assist in substrate, interposer and bump designs for test vehicles and probe cards.
• Contribute to design verification efforts to ensure performance and quality.
• Analyze yield and defect metrics and help improve yield and efficiency.

Skills

Transmission lines knowledge

Data analytics

PowerBI

Design software

Scripting: Perl/Python/SQL

Education

Master's degree in Electrical Engineering

Engineering Science or Computer/Mechanical/Materials focus

Related field in Engineering

Tools

Package/Silicon/PCB design software

Job description

AMD invites motivated students to join as ASIC Package Engineering interns or co-ops. You will work with engineers to bring new packaging technologies to life and gain real-world experience on projects impacting millions of end-users worldwide.

Open to undergraduates or PhD students currently enrolled in a US-based university, this program offers hands-on training, team collaboration, and exposure to next-generation packaging solutions, with hybrid or onsite work options.