Lead SI/PI Architect — High-Speed Interconnects & Packaging

NVIDIA Corporation

Santa Clara (CA)

On-site

USD 320,000 - 489,000

Full time

3 days ago
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Job summary

NVIDIA Corporation in Santa Clara, CA is seeking a Distinguished Signal & Power Integrity Engineer to lead advanced SI strategies for high-speed interconnects and packaging across AI and HPC platforms. The role requires 15+ years of experience and a strong record in deploying next-gen technologies.

You will shape standards for UCIe, HBM, DDR, PCIe, and SerDes, mentor teams, and guide research toward scalable, high-volume manufacturing solutions while aligning with executive priorities.

Qualifications

  • 15+ years leading innovations in high-speed signaling, electromagnetics, and packaging.
  • Hands-on invention and deployment of advanced solutions like EMIB, UCIe, CPO.
  • Experience managing and mentoring teams from research to high-volume manufacturing.

Responsibilities

  • Lead development and execution of corporate-level strategies for high-speed signaling.
  • Oversee direction and implementation for next-gen products from ultra-mobile to AI/HPC.
  • Architect interconnect and packaging solutions for UCIe, HBM, DDR, PCIe, SerDes.
  • Enable packaging technology for co-packaged optics, chiplet architectures, IVR.
  • Develop modeling and characterization flows, automation, and high-volume manufacturing techniques.
  • Provide strategic counsel to senior leadership on signaling, packaging, and system integration.

Skills

High-speed signaling
Computational electromagnetics
Semiconductor packaging

Education

MS/PhD in Electrical Engineering or equivalent

Job description

NVIDIA Corporation in Santa Clara, CA is seeking a Distinguished Signal & Power Integrity Engineer to lead advanced SI strategies for high-speed interconnects and packaging across AI and HPC platforms. The role requires 15+ years of experience and a strong record in deploying next-gen technologies.

You will shape standards for UCIe, HBM, DDR, PCIe, and SerDes, mentor teams, and guide research toward scalable, high-volume manufacturing solutions while aligning with executive priorities.

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