Senior Signal & Power Integrity Architect

Thomas To; Santa Clara (CA); On-site; USD 320,000 - 489,000; Full time

Job summary

NVIDIA is seeking a Distinguished Signal & Power Integrity Engineer to lead corporate-level strategies for high-speed signaling across advanced packaging and interconnects. You will guide design directions for products from ultra-mobile to AI/HPC platforms and mentor senior engineers.

The role requires 15+ years in SI, electromagnetics, and packaging, with MS/PhD in EE. Equity, benefits, and a competitive base are provided. This posting represents an existing vacancy at NVIDIA.

Qualifications

• 15+ years leading innovations spanning high-speed signal integrity, computational electromagnetics, and semiconductor assembly technologies.
• MS/PhD in Electrical Engineering or equivalent with 15+ years of industry experience.
• Hands‑on invention and deployment of advanced solutions e.g., EMIB, UCIe, CPO, high density connectors.
• Deep experience with electrical, computer, and packaging engineering and deployment of such in products.
• Demonstrated ability to manage and mentor teams of highly skilled engineers, define methodologies, and deliver complex projects from research to high-volume manufacturing.

Responsibilities

• Lead the development and execution of corporate-level strategies for high-speed signaling technologies across advanced semiconductor packaging, sockets, and connectors.
• Oversee technical direction and implementation for next-gen products ranging from ultra-mobile to high-performance AI and HPC platforms.
• Architect and deliver state-of-the-art interconnect and packaging solutions for standards such as UCIe, HBM, DDR, PCIe, and industry-leading SerDes (224G/448G).
• Enable advanced packaging technology solutions for co-packaged optics, stacked die, chiplet-based architectures and IVR solutions.
• Development of modeling and characterization flows, flow automations, design for high volume manufacturing techniques.
• Offer strategic counsel as a recognized subject matter expert to senior leadership on emerging technologies, technology investment, and research priorities in signaling, packaging, and system integration.

Skills

High-speed signaling

Electromagnetics modeling

Semiconductor assembly

Team leadership

Packaging engineering

Education

MS/PhD in Electrical Engineering

Tools

EMIB

UCIe

CPO

HDI connectors

Job description

NVIDIA is seeking a Distinguished Signal & Power Integrity Engineer to lead corporate-level strategies for high-speed signaling across advanced packaging and interconnects. You will guide design directions for products from ultra-mobile to AI/HPC platforms and mentor senior engineers.

The role requires 15+ years in SI, electromagnetics, and packaging, with MS/PhD in EE. Equity, benefits, and a competitive base are provided. This posting represents an existing vacancy at NVIDIA.