Lead R&D Engineer, Advanced Packaging for AI & HPC

Broadcom Inc.

San Jose (CA)

On-site

USD 167,500 - 268,000

Full time

14 days+

A complete application in a minute

Tailored resume and cover letter, ready to send.

Get past ATS filters

Benefits offered by this job

Medical, dental, and vision plans
401(k) with company matching
Employee Stock Purchase Program
Paid holidays and vacation
Paid family leave

Job summary

Broadcom Inc. is seeking a Senior Technical Lead in San Jose, California, to oversee multi-chip semiconductor assembly and development of new technologies. The ideal candidate will have a strong background in advanced packaging and significant experience in semiconductor R&D and production.

The position offers a salary range of $167,500 to $268,000, a discretionary annual bonus, equity awards, and a comprehensive benefits package including medical and 401(k) matching.

Qualifications

  • 15+ years of experience in semiconductor process technology preferred.
  • Experience in advanced packaging and manufacturing is essential.
  • Significant R&D and integration roles are required.

Responsibilities

  • Lead technical efforts in semiconductor assembly and pathfinding.
  • Drive development of assembly technology from R&D to production.
  • Define technology requirements and provide application support.
  • Manage independent projects and facilitate communications.
  • Conduct risk assessment for multiple projects.

Skills

Advanced packaging knowledge
Chip-to-chip communication design
Statistical data analysis
Yield failure mechanisms
Thermal simulation tools
Data analysis
Problem-solving
Interpersonal skills

Education

MSEE in Electrical Engineering
PhD in relevant field

Job description

Broadcom Inc. is seeking a Senior Technical Lead in San Jose, California, to oversee multi-chip semiconductor assembly and development of new technologies. The ideal candidate will have a strong background in advanced packaging and significant experience in semiconductor R&D and production.

The position offers a salary range of $167,500 to $268,000, a discretionary annual bonus, equity awards, and a comprehensive benefits package including medical and 401(k) matching.

Get your free, confidential resume review.

or drag and drop your file here.

Similar jobs

Similar jobs worth comparing

R&D Engineer
R&D Engineer

Broadcom Inc. • San Jose (CA)

On-site
USD 167,500 - 268,000
Medical, dental, and vision plans
401(k) with company matching
Employee Stock Purchase Program
+2
Lead 2.5D/3D Advanced Packaging Engineer
Lead 2.5D/3D Advanced Packaging Engineer

Broadcom, Inc. • San Jose (CA)

On-site
USD 200,000 - 260,000
Medical
Dental
Vision
+7
Lead 2.5D/3D Advanced Package Engineer
Lead 2.5D/3D Advanced Package Engineer

Broadcom Inc. • Fort Collins (CO)

On-site
USD 120,000 - 180,000
Medical, dental, vision
401(k) with company match
Employee stock purchase program
+1
Lead ASIC Package Design Projects — High-Speed AI/HPC
Lead ASIC Package Design Projects — High-Speed AI/HPC

Broadcom Inc. • Fort Collins (CO)

On-site
USD 140,000 - 230,000
Annual bonus
Equity grants
ESPP
+2
Senior 2.5D/3D Packaging Architect
Senior 2.5D/3D Packaging Architect

Broadcom • San Jose (CA)

On-site
USD 190,000 - 260,000
Advanced Package Technology Engineer
Advanced Package Technology Engineer

Broadcom, Inc. • San Jose (CA)

On-site
USD 200,000 - 260,000
Medical
Dental
Vision
+7
Advanced Package Technology Engineer
Advanced Package Technology Engineer

Broadcom • San Jose (CA)

On-site
USD 190,000 - 260,000
Lead SoC Packaging Architect for Next-Gen Chips
Lead SoC Packaging Architect for Next-Gen Chips

W3Global • Santa Clara (CA)

On-site
USD 180,000 - 240,000
Medical insurance
Dental insurance
Vision insurance
+2
Head of Packaging - Silicon Photonics AI Hardware
Head of Packaging - Silicon Photonics AI Hardware

SBT • San Francisco (CA)

On-site
USD 180,000 - 260,000
Senior 2.5D/3D Packaging Engineer
Senior 2.5D/3D Packaging Engineer

Broadcom, Inc. • Fort Collins (CO)

On-site
USD 140,000 - 210,000