Senior 2.5D/3D Packaging Engineer

Broadcom, Inc.; Fort Collins (CO); Presencial; USD 140.000 - 210.000; Jornada completa

Descripción de la vacante

Broadcom, Inc. is seeking an Advanced Package Technology Engineer in Fort Collins, CO to drive 2.5D/3D packaging technology.

You will collaborate with silicon and package design, marketing, NPI, and suppliers to define needs and deliver high-performance, cost-effective packaging that meets signal integrity and thermal requirements. As Technology Leader, you will oversee 2.5D/3D development, manage external partners for qualification, and work with cross-functional teams on design, test, and

Formación

• PhD or MS in Mechanical, Electrical, or Electronics Engineering.
• 10+ years of relevant experience in advanced packaging.
• Experience with 2.5D/3D packaging, interposers, substrates, and wafer-level packaging.

Responsabilidades

• Technology Leadership in 2.5D and 3D advanced packaging.
• Lead identification, development, and qualification of packaging solutions with external partners.
• Cross-functional collaboration with Design Integration, Package Design, and Test Development.

Conocimientos

2.5D packaging

3D packaging

Heterogeneous integration

Thermal modelling

Mechanical modelling

AutoCAD

SolidWorks

Wafer-level packaging

Interposers

Substrates

Educación

PhD or MS in Mechanical/Electrical/Electronic Eng

Herramientas

APD

AutoCAD

SolidWorks

Descripción del empleo

Broadcom, Inc. is seeking an Advanced Package Technology Engineer in Fort Collins, CO to drive 2.5D/3D packaging technology.

You will collaborate with silicon and package design, marketing, NPI, and suppliers to define needs and deliver high-performance, cost-effective packaging that meets signal integrity and thermal requirements. As Technology Leader, you will oversee 2.5D/3D development, manage external partners for qualification, and work with cross-functional teams on design, test, and