Lead 2.5D/3D Advanced Packaging Engineer

Broadcom, Inc.; San Jose (CA); On-site; USD 200,000 - 260,000; Full time

Benefits offered by this job

Medical

Dental

Vision

401K

ESPP

EAP

Holidays

Sick leave

Vacation

Family leave

Job summary

Broadcom, Inc. is seeking a senior packaging leader to drive 2.5D/3D advanced packaging architectures in collaboration with silicon, package design, and marketing teams. You will lead cross-functional efforts with external assembly and memory partners to meet stringent requirements.

The role requires a PhD or Master's in engineering and 10+ years of packaging experience, including substrates/interposers and wafer-level approaches. Travel may be required.

Qualifications

• Ph.D./Master’s degree in Mechanical, Electrical, or Electronics Engineering with 10+ years of relevant experience.
• Packaging expertise in cost-effective, high-performance packaging.
• Experience with large, complex substrates and interposers, including fine-pitch flip-chip packaging.
• 6+ years hands-on in 2.5D/3D package development and heterogeneous integration.
• Deep understanding of silicon fabrication, bumping, interposer, substrate, and assembly processes.

Responsibilities

• Lead technology leadership in 2.5D/3D advanced packaging and define customer needs.
• Oversee development and qualification of advanced packaging solutions with external partners.
• Interface with Design Integration, Package Design and Test Development teams.
• Support NPI and high-volume manufacturing ramps and sourcing initiatives.

Skills

2.5D/3D packaging

Substrates & Interposers

Wafer-level packaging

Thermal–mechanical modelling

Cross-functional leadership

Education

PhD/Master in Engineering

Tools

APD CAD Tools

Job description

Broadcom, Inc. is seeking a senior packaging leader to drive 2.5D/3D advanced packaging architectures in collaboration with silicon, package design, and marketing teams. You will lead cross-functional efforts with external assembly and memory partners to meet stringent requirements.

The role requires a PhD or Master's in engineering and 10+ years of packaging experience, including substrates/interposers and wafer-level approaches. Travel may be required.