Advanced Package Technology Engineer

Broadcom; San Jose (CA); On-site; USD 190,000 - 260,000; Full time

Job summary

Broadcom in San Jose, CA seeks a senior packaging leader to drive 2.5D/3D advanced packaging developments. You will shape cost-effective, high-performance solutions while coordinating with silicon, package design, marketing, NPI, and suppliers.

You will lead cross-functional teams, manage NPI and sourcing, and ensure design rules, signal integrity, thermal performance, and reliability targets are met on schedule. A Ph.D.

Qualifications

• Ph.D./M.S. in Mechanical, Electrical, or Electronics Engineering with 10+ years of relevant experience.
• Proven track record in developing cost-effective, high-performance 2.5D/3D packaging.
• Experience with large, complex substrates, interposers, and wafer-level packaging.

Responsibilities

• Lead development of cost-effective, high-performance packaging solutions.
• Define needs with customers and partners; drive unified solutions.
• Collaborate with Design Integration, Package Design, and Test Development.
• Support NPI and sourcing; manage high-volume manufacturing ramps.

Skills

2.5D/3D packaging

Cross-functional collaboration

Project management

Thermal‑mechanical modelling

Education

PhD or MSc in Mechanical, Electrical, or Electronics Engineering

Tools

APD

AutoCAD

SolidWorks

Job description

Role Overview

As a key member of the Worldwide (WW) ASIC Product Development team, you will collaborate closely with silicon and package design, marketing, NPI, assembly/substrate suppliers, and customers. You will lead the development of cost-effective, high-performance, advanced custom packaging solutions that meet stringent signal integrity, thermal, structural reliability, design rule, and project schedule requirements.

Job Description

With 2.5D and 3D technologies pushing the boundaries of modern packaging, you will play a pivotal role in driving cutting-edge architectures to meet future customer and product demands.

Key Responsibilities

• Technology Leadership: Serve as the subject matter expert in 2.5D and 3D advanced packaging technologies, engaging with current and future customers to define needs, consolidate requirements, and drive unified solutions.
• Partner & Program Management: Lead the identification, development, and qualification of advanced packaging solutions, overseeing program management with external assembly and memory partners to define technology and quality requirements.
• Cross-Functional Collaboration: Interface seamlessly with internal technical teams—including Design Integration, Package Design, and Test Development—as part of a dynamic cross-functional team.
• NPI & Sourcing Support: Support new design wins, New Product Introduction (NPI), and high-volume manufacturing ramps, while driving alternate sourcing and qualification initiatives.

Candidate Qualifications & Requirements

• Education & Experience: Ph.D./ Master’s degree in Mechanical, Electrical, or Electronics Engineering, with 10+ years of relevant experience.
• Packaging Expertise: Proven track record in developing cost-effective, high-performance (optimized for speed, density, pin count, thermal performance, and reliability) single- and multi-chip solutions.
• Substrates & Interposers: Experience with large, complex, custom, and fine-pitch flip-chip packaging solutions utilizing advanced multi-layer ceramic/organic substrates and interposers, as well as wafer-level packaging solutions.

Specific Qualifications

• Advanced Packaging: 6+ years of hands‑on experience in 2.5D / 3D package development and heterogeneous integration.
• Process & Materials Know‑How: In-depth understanding of advanced silicon fabrication, bumping, interposer, substrate, and assembly processes, alongside materials selection, supplier evaluation, BOM definition, and thermal‑mechanical interactions.

Additional Competencies

• Technical Skills:
  • Comprehensive knowledge of prevailing and emerging silicon, package, and substrate technologies, design rules, failure analysis techniques, materials, equipment, and industry standards/quality systems.
  • Hands‑on experience using thermal and mechanical modelling tools, alongside substrate/PCB design CAD tools (e.g., APD, AutoCAD, SolidWorks) for design optimization.
  • Solid understanding of advanced-node silicon fabrication, PCB technologies, and board assembly processes.
• Soft Skills: A self‑driven, flexible, agile, and results‑oriented team player with strong analytical, problem‑solving, project management, and interpersonal skills. Proven ability to conceptualize structured projects, innovate around complex problems, and manage multiple programs concurrently.
• Communication & Travel: Excellent communication skills for extensive collaboration with global internal/external teams and customers. Periodic travel may be required.

Compensation And Benefits

The annual base salary range for this position is USD To USD

As a valued member of our team, you'll be eligible for a discretionary annual bonus and the opportunity to receive not only a competitive new hire equity grant, but also annual equity awards, connecting your success directly to the company's growth. All subject to relevant plan documents and award agreements.

Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.

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