Lead 2.5D/3D Advanced Package Engineer

Broadcom Inc.; Fort Collins (CO); On-site; USD 120,000 - 180,000; Full time

Benefits offered by this job

Medical, dental, vision

401(k) with company match

Employee stock purchase program

Paid holidays and vacation

Job summary

Broadcom Inc. is seeking an Advanced Package Technology Engineer to develop cost-effective, high-performance 2.5D/3D packaging solutions.

The role involves close collaboration with silicon, packaging, design, and supplier teams to meet ambitious timelines and performance goals. The candidate should have hands-on 4–6 years in 2.5D/3D development, strong knowledge of substrates, interposers, and related processes, and proven project management and collaboration skills.

Qualifications

• Master's degree required with 6+ years in advanced packaging.
• Hands-on experience in 2.5D/3D development and interposer/substrate processes.
• Ability to engage with silicon fab, memory suppliers and external partners.
• Strong project management, analytical and teamwork skills.

Responsibilities

• Provide deeper expertise in 2.5D/3D technology and drive unified solutions.
• Lead in identification, development & qualification; manage external partners.
• Engage memory suppliers to define technology and quality requirements.
• Interface with Pkg Design, Test Dev and other teams as part of cross-functional work.
• Support new design wins, NPI and volume ramps.
• Develop alternate sourcing & qualification.

Skills

2.5D/3D packaging

Project management

Thermal/mechanical analysis

Cross-functional collaboration

Supplier engagement

Education

Master's degree in Mechanical/Electrical/Electronics Engineering

PhD with 3+ years of experience

Tools

APD modelling

AutoCAD

SolidWorks

BOM definition tools

Job description

Broadcom Inc. is seeking an Advanced Package Technology Engineer to develop cost-effective, high-performance 2.5D/3D packaging solutions.

The role involves close collaboration with silicon, packaging, design, and supplier teams to meet ambitious timelines and performance goals. The candidate should have hands-on 4–6 years in 2.5D/3D development, strong knowledge of substrates, interposers, and related processes, and proven project management and collaboration skills.