Lead ASIC Package Design Projects — High-Speed AI/HPC

Broadcom Inc.; Fort Collins (CO); On-site; USD 140,000 - 230,000; Full time

Benefits offered by this job

Annual bonus

Equity grants

ESPP

Healthcare benefits

Paid time off

Job summary

Broadcom Inc. is seeking an experienced IC Package Design Project Manager to lead a team developing complex flip-chip-BGA packages for high-performance ASICs in AI, HPC, and 5G. You will manage 20+ designs, coordinate with vendors and internal teams, and drive packaging methodologies in a global R&D setting.

The role requires on-site work at Broadcom offices five days a week, with occasional travel. Strong background in package design, SI/PI, and cross-functional collaboration is essential.

Qualifications

• Previous experience managing package design projects is preferred.
• Knowledge of package-level signal integrity and power integrity.
• Cooperate with a world-wide team across time zones.
• Strong self-management and organizational skills.
• Technical understanding of package design: lifecycle, DFx trade-offs, layout SI/PI extractions.

Responsibilities

• Create and track project plans for 20+ concurrent designs (scope, schedules, resources).
• Improve scheduling methodologies and task tracking and coordination.
• Organize team and customer activities to keep projects on track.
• Communicate plans, status, next steps and risks.
• Create technical methodologies for package design.

Skills

Project management

Package design

SI/PI knowledge

Cross-functional leadership

Self-management

Communication skills

Education

Bachelor's degree

Master's degree in related field

Job description

Broadcom Inc. is seeking an experienced IC Package Design Project Manager to lead a team developing complex flip-chip-BGA packages for high-performance ASICs in AI, HPC, and 5G. You will manage 20+ designs, coordinate with vendors and internal teams, and drive packaging methodologies in a global R&D setting.

The role requires on-site work at Broadcom offices five days a week, with occasional travel. Strong background in package design, SI/PI, and cross-functional collaboration is essential.