Advanced Package Technology Engineer

Broadcom, Inc.; San Jose (CA); On-site; USD 200,000 - 260,000; Full time

Benefits offered by this job

Medical

Dental

Vision

401K

ESPP

EAP

Holidays

Sick leave

Vacation

Family leave

Job summary

Broadcom, Inc. is seeking a senior packaging leader to drive 2.5D/3D advanced packaging architectures in collaboration with silicon, package design, and marketing teams. You will lead cross-functional efforts with external assembly and memory partners to meet stringent requirements.

The role requires a PhD or Master's in engineering and 10+ years of packaging experience, including substrates/interposers and wafer-level approaches. Travel may be required.

Qualifications

• Ph.D./Master’s degree in Mechanical, Electrical, or Electronics Engineering with 10+ years of relevant experience.
• Packaging expertise in cost-effective, high-performance packaging.
• Experience with large, complex substrates and interposers, including fine-pitch flip-chip packaging.
• 6+ years hands-on in 2.5D/3D package development and heterogeneous integration.
• Deep understanding of silicon fabrication, bumping, interposer, substrate, and assembly processes.

Responsibilities

• Lead technology leadership in 2.5D/3D advanced packaging and define customer needs.
• Oversee development and qualification of advanced packaging solutions with external partners.
• Interface with Design Integration, Package Design and Test Development teams.
• Support NPI and high-volume manufacturing ramps and sourcing initiatives.

Skills

2.5D/3D packaging

Substrates & Interposers

Wafer-level packaging

Thermal–mechanical modelling

Cross-functional leadership

Education

PhD/Master in Engineering

Tools

APD CAD Tools

Job description

Role Overview

As a key member of the Worldwide (WW) ASIC Product Development team, you will collaborate closely with silicon and package design, marketing, NPI, assembly/substrate suppliers, and customers. You will lead the development of cost-effective, high-performance, advanced custom packaging solutions that meet stringent signal integrity, thermal, structural reliability, design rule, and project schedule requirements. With 2.5D and 3D technologies pushing the boundaries of modern packaging, you will play a pivotal role in driving cutting-edge architectures to meet future customer and product demands.

Key Responsibilities

• Technology Leadership: Serve as the subject matter expert in 2.5D and 3D advanced packaging technologies, engaging with current and future customers to define needs, consolidate requirements, and drive unified solutions.
• Partner & Program Management: Lead the identification, development, and qualification of advanced packaging solutions, overseeing program management with external assembly and memory partners to define technology and quality requirements.
• Cross-Functional Collaboration: Interface seamlessly with internal technical teams—including Design Integration, Package Design, and Test Development—as part of a dynamic cross-functional team.
• NPI & Sourcing Support: Support new design wins, New Product Introduction (NPI), and high-volume manufacturing ramps, while driving alternate sourcing and qualification initiatives.

Candidate Qualifications & Requirements

• Education & Experience: Ph.D./ Master’s degree in Mechanical, Electrical, or Electronics Engineering, with 10+ years of relevant experience.
• Packaging Expertise: Proven track record in developing cost-effective, high-performance (optimized for speed, density, pin count, thermal performance, and reliability) single- and multi-chip solutions.
• Substrates & Interposers: Experience with large, complex, custom, and fine-pitch flip-chip packaging solutions utilizing advanced multi-layer ceramic/organic substrates and interposers, as well as wafer-level packaging solutions.
• Advanced Packaging: 6+ years of hands‑on experience in 2.5D / 3D package development and heterogeneous integration.
• Process & Materials Know-How: In-depth understanding of advanced silicon fabrication, bumping, interposer, substrate, and assembly processes, alongside materials selection, supplier evaluation, BOM definition, and thermal‑mechanical interactions.
• Additional Competencies: Technical Skills: comprehensive knowledge of prevailing and emerging silicon, package, and substrate technologies, design rules, failure analysis techniques, materials, equipment, and industry standards/quality systems. Hands‑on experience using thermal and mechanical modelling tools, alongside substrate/PCB design CAD tools (e.g., APD, AutoCAD, SolidWorks) for design optimisation. Solid understanding of advanced-node silicon fabrication, PCB technologies, and board assembly processes.
• Soft Skills: self‑driven, flexible, agile, and results-oriented team player with strong analytical, problem‑solving, project management, and interpersonal skills. Proven ability to conceptualise structured projects, innovate around complex problems, and manage multiple programmes concurrently.
• Communication & Travel: Excellent communication skills for extensive collaboration with global internal/external teams and customers. Periodic travel may be required.

Compensation and Benefits

The annual base salary range for this position is USD To USD

As a valued member of our team, you'll be eligible for a discretionary annual bonus and the opportunity to receive not only a competitive new hire equity grant, but also annual equity awards, connecting your success directly to the company's growth. All subject to relevant plan documents and award agreements.

Broadcom offers a competitive and comprehensive benefits package:

• Medical
• Dental
• Vision plans
• 401(K) participation including company matching
• Employee Stock Purchase Program (ESPP)
• Employee Assistance Program (EAP)
• Company paid holidays
• Paid sick leave
• Vacation time
• Paid Family Leave and other leaves of absence

Equal Opportunity

Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.

Location

If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.

About Broadcom

Thank you for your interest in Broadcom! We are a global technology leader that designs, develops and supplies a broad range of semiconductor and infrastructure software solutions.

For more information please visit our video library and check out our Connected by Broadcom series. Follow us on Linked In Broadcom Inc.