Innovative ASIC Package Engineering Intern/Co-op

Advanced Micro Devices, Inc.; Fort Collins (CO); Hybrid; USD 30,000 - 39,000; Full time

Benefits offered by this job

AMD benefits

Job summary

Advanced Micro Devices, Inc. (AMD) is seeking a motivated ASIC Package Engineering intern/co-op to join the team in Fort Collins, CO. You will work with engineers to bring advanced packaging technology to reality, supporting design, verification, and yield analysis.

The role offers full-time hours during the term, with hybrid or onsite options. Requirements include a US-based Master's program in relevant engineering fields and familiarity with scripting and packaging processes.

Qualifications

• Enrolled in a US-based university with a Master's in EE, Eng. Science, CE, ME, or related field.
• Knowledge of transmission lines and electric circuits.
• Familiar with scripting languages (Perl, Python, SQL).
• Experience with data analytics or Power BI.

Responsibilities

• Assist in supporting Package design and Development Engineers.
• Prepare substrate, interposer, and bump designs.
• Contribute to design verification to ensure performance.
• Analyze yield and defect metrics to improve yield.
• Evaluate packaging materials and coordinate with partners for cost-efficient designs.

Skills

Perl

Python

SQL

Education

Master's degree in Electrical Engineering / related field

Tools

Package design software

Silicon design software

PCB design software

Job description

Advanced Micro Devices, Inc. (AMD) is seeking a motivated ASIC Package Engineering intern/co-op to join the team in Fort Collins, CO. You will work with engineers to bring advanced packaging technology to reality, supporting design, verification, and yield analysis.

The role offers full-time hours during the term, with hybrid or onsite options. Requirements include a US-based Master's program in relevant engineering fields and familiarity with scripting and packaging processes.