ASIC Package Engineering Co-op: Design & Yield Impact

Advanced Micro Devices, Inc.; Town of Fishkill (NY); Hybrid; USD 33,000 - 60,000; Full time

Job summary

Advanced Micro Devices, Inc. (AMD) is seeking a highly motivated ASIC Package Engineering intern/co-op to work with our team on next-generation packaging technology.

You will assist in prioritizing projects, learn substrate/interposer/bump design for AMD products, and contribute to design verification and yield improvement. Ideal candidates are enrolled in a US university for a Master’s degree in Electrical/Computer Engineering, with coursework in packaging, PCB/Si design, and scripting

Qualifications

• Currently enrolled in a US-based university in a Master’s degree program in Electrical Engineering, Engineering Science, Computer Engineering, Mechanical Engineering, or a related field.
• Relevant coursework or experience in ASIC packaging, substrate/interposer design, and data analytics is valued.

Responsibilities

• Assist in prioritizing and optimizing new ASIC packaging projects.
• Train on substrate, interposer and bump designs for AMD products and test vehicles.
• Support design verification to ensure performance, quality and efficiency.
• Analyze yield and defect metrics to improve design yield.
• Evaluate packaging materials and benchmark options with partners for cost-effective design.

Skills

ASIC Packaging

Package Design

Design Verification

Data Analytics

Python

PowerBI

Education

Master's in Electrical Engineering

Master's in Computer Engineering

Tools

Package design software

PCB/Si design tools

Job description

Advanced Micro Devices, Inc. (AMD) is seeking a highly motivated ASIC Package Engineering intern/co-op to work with our team on next-generation packaging technology.

You will assist in prioritizing projects, learn substrate/interposer/bump design for AMD products, and contribute to design verification and yield improvement. Ideal candidates are enrolled in a US university for a Master’s degree in Electrical/Computer Engineering, with coursework in packaging, PCB/Si design, and scripting