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Advanced Micro Devices, Inc. is seeking an ASIC Package Engineering intern/co-op to join our team and help bring new packaging technology to reality. You will support package design and development, learn substrate/interposer/bump design, and work on design verification and yield analysis with mentors.
Gain hands-on experience on real AMD projects, with a 40-hour work week, in hybrid or onsite settings across multiple locations (Austin, Boxborough, Fishkill, Fort Collins, Longmont, Secaucus).
Advanced Micro Devices, Inc. is seeking an ASIC Package Engineering intern/co-op to join our team and help bring new packaging technology to reality. You will support package design and development, learn substrate/interposer/bump design, and work on design verification and yield analysis with mentors.
Gain hands-on experience on real AMD projects, with a 40-hour work week, in hybrid or onsite settings across multiple locations (Austin, Boxborough, Fishkill, Fort Collins, Longmont, Secaucus).