ASIC Package Engineer Intern: Design, Yield & Impact

Advanced Micro Devices, Inc.; Longmont (CO); Hybrid; USD 34,000 - 52,000; Full time

Benefits offered by this job

AMD benefits at a glance

Job summary

Advanced Micro Devices, Inc. (AMD) seeks a highly motivated ASIC Package Engineering intern/co-op to join the packaging team. You will work with engineers to bring advanced packaging tech to reality, supporting design and development of substrates, interposers, and bumps for AMD products.

The role involves learning package design, verification, and material benchmarking, with emphasis on yield improvement and cost efficiency during the internship or co-op term.

Qualifications

• Enrolled in a US-based university for a Bachelor's in EE/related field.
• Interest or knowledge in packaging technology and design software.
• Familiarity with scripting (Perl/Python/SQL) encouraged.
• Knowledge of data analytics and Power BI is a plus.
• Understanding of transmission lines and electric circuits is beneficial.

Responsibilities

• Support package design and development engineers on prioritizing and optimizing new projects.
• Assist in completing substrate, interposer and bump designs for AMD products and test vehicles.
• Participate in design verification to ensure performance and quality.
• Analyze yield and defect metrics to improve design performance and yield.
• Evaluate and benchmark packaging materials for cost efficiency and performance.

Skills

Electrical circuits

Scripting languages

Semiconductor theory

Data analytics

Power BI

Education

Bachelor's degree in Electrical Engineering or related field

Tools

Package design software

PCB design software

Job description

Advanced Micro Devices, Inc. (AMD) seeks a highly motivated ASIC Package Engineering intern/co-op to join the packaging team. You will work with engineers to bring advanced packaging tech to reality, supporting design and development of substrates, interposers, and bumps for AMD products.

The role involves learning package design, verification, and material benchmarking, with emphasis on yield improvement and cost efficiency during the internship or co-op term.