ASIC Packaging Engineer Intern — Co-op

Advanced Micro Devices, Inc.; Fort Collins (CO); Hybrid; USD 40,000 - 62,000; Full time

Job summary

Advanced Micro Devices, Inc. is seeking an ASIC Package Engineering intern/co-op to join our team. You will work with engineers to bring new packaging technology to reality, supporting design and development across substrates, interposers and bumps.

The role requires enrollment in a US university for a Bachelors in a related engineering field, with exposure to scripting, packaging software, and data analytics. This position offers hybrid or onsite work structures and is not visa-sponsored.

Qualifications

• Currently enrolled in a US-based university pursuing a Bachelor’s degree in Electrical Engineering or a related field.
• Coursework in transmission lines, circuits, or packaging-related topics is a plus.
• Experience with scripting languages and PCB/package design tools is desirable.

Responsibilities

• Assist in packaging design and development activities for AMD products.
• Learn substrate, interposer, and bump design methods for test vehicles and probes.
• Support design verification to ensure performance and quality.
• Analyze yield and defect data to drive improvements in design and yield.
• Evaluate packaging materials and work with internal/partner teams for cost-efficient solutions.

Skills

Python

Perl

SQL

Data analytics

Education

Bachelor's degree in Electrical Engineering

Engineering-related field

Tools

PowerBI

Package design software

Job description

Advanced Micro Devices, Inc. is seeking an ASIC Package Engineering intern/co-op to join our team. You will work with engineers to bring new packaging technology to reality, supporting design and development across substrates, interposers and bumps.

The role requires enrollment in a US university for a Bachelors in a related engineering field, with exposure to scripting, packaging software, and data analytics. This position offers hybrid or onsite work structures and is not visa-sponsored.