ASIC Package Eng Intern/Co-op: Design, Yield & Innovation

Advanced Micro Devices, Inc.; Boxborough (MA); Hybrid; USD 22,000 - 36,000; Full time

Job summary

Advanced Micro Devices, Inc. (AMD) is offering an ASIC Package Engineering intern/co-op position in the US.

You will work with a team of engineers to advance packaging technology, participate in substrate, interposer and bump design, and help optimize design verification and yield. The role requires full-time commitment (40 hours/week) in hybrid or onsite settings, with multiple location options across the US.

Qualifications

• Currently enrolled in a US university pursuing a Master's in Electrical/Computer/Mechanical Engineering or related field.
• Interest in ASIC packaging and development for AMD products.
• Experience or coursework in scripting languages (Python/Perl/SQL).
• Familiarity with data analytics and visualization tools like Power BI.

Responsibilities

• Support package design and development engineers in prioritizing and optimizing new projects.
• Learn substrate, interposer, and bump design for AMD products and test vehicles.
• Assist in design verification to ensure performance, quality and efficiency.
• Analyze yield and defect metrics to improve design performance and yield.
• Evaluate packaging materials and interact with partners to optimize cost and performance.

Skills

ASIC packaging

Package design

Python

Perl

SQL

Data analytics

Power BI

Education

Master's degree in Electrical Engineering

Tools

Package design software

PCB design software

Substrate design tools

Job description

Advanced Micro Devices, Inc. (AMD) is offering an ASIC Package Engineering intern/co-op position in the US.

You will work with a team of engineers to advance packaging technology, participate in substrate, interposer and bump design, and help optimize design verification and yield. The role requires full-time commitment (40 hours/week) in hybrid or onsite settings, with multiple location options across the US.