HBM Core-Die Architecture & Circuit Lead

Micron Technology, Inc.; Folsom (CA); On-site; USD 139,000 - 308,000; Full time

Job summary

Micron Technology, Inc. is seeking an HBM Core-Die Architecture & Circuit Design Engineer to own the next-generation core-die architecture and critical DRAM circuit design.

You will influence bandwidth, power, area, and reliability across advanced 3D-stacked HBM products, driving ARD development and cross-functional execution. You will collaborate with multiple teams, support silicon bring-up, and help define robust design methodologies while ensuring performance and reliability benchmarks

Qualifications

• Proven experience in DRAM architecture and circuit design (HBM, DDR, LPDDR, GDDR, or equivalent).
• Hands-on experience with SPICE-based circuit simulation tools (HSPICE, Spectre, FineSim, PrimeSim, or equivalent).
• Ability to evaluate performance, power, area, thermal, and reliability trade-offs.

Responsibilities

• Own HBM core-die architecture including Bank/Bank-Group organization, array partitioning, datapath, refresh, and reliability features.
• Drive critical DRAM circuit design and timing closure for row, column, sensing, and datapath paths.
• Develop and optimize architecture solutions for bandwidth, power, area, thermal, and reliability trade-offs.
• Define and validate refresh, row-hammer mitigation, data-retention, and power-efficient operation schemes.
• Lead architecture feasibility studies using transistor-level simulation and physical implementation analysis.
• Develop HBM Architecture Reference Designs (ARD), including golden schematics, timing budgets, and verification methodology.
• Collaborate with Array, Datapath, ECC, TSV, PDN, Layout, Verification, and DFT teams to drive end-to-end design execution.
• Support silicon bring-up, characterization, failure analysis, and architecture-to-design handoff.

Skills

DRAM architecture

Circuit design

SPICE simulations

Cross-functional teamwork

Problem solving

Communication

Tools

HSPICE

Spectre

FineSim

PrimeSim

Job description

Micron Technology, Inc. is seeking an HBM Core-Die Architecture & Circuit Design Engineer to own the next-generation core-die architecture and critical DRAM circuit design.

You will influence bandwidth, power, area, and reliability across advanced 3D-stacked HBM products, driving ARD development and cross-functional execution. You will collaborate with multiple teams, support silicon bring-up, and help define robust design methodologies while ensuring performance and reliability benchmarks