HBM Architecture & Circuit Design Lead

Micron Technology, Inc.; Boise (ID); On-site; USD 120,000 - 180,000; Full time

Job summary

Micron Technology, Inc. is seeking an engineer to own HBM core-die architecture and critical DRAM circuit design, impacting bandwidth, power, area, and reliability. You will drive architecture definition, circuit feasibility, and ARD development for advanced 3D-stacked HBM products.

The role requires hands-on experience with SPICE-based tools and a track record of architecture decisions across cross-functional teams to deliver end-to-end design and silicon bring-up support.

Qualifications

• Proven experience in DRAM architecture and circuit design (HBM, DDR, LPDDR, GDDR, or equivalent)
• Strong understanding of DRAM array architecture, row/column paths, sensing, datapath, refresh, and reliability mechanisms
• Hands-on experience with SPICE-based circuit simulation tools (HSPICE, Spectre, FineSim, PrimeSim, or equivalent)
• Ability to evaluate performance, power, area, thermal, and reliability trade-offs
• Experience driving architecture decisions and cross-functional technical execution
• Strong problem-solving and communication skills

Responsibilities

• Own HBM core-die architecture including Bank/Bank‑Group organization, array partitioning, datapath, refresh, and reliability features
• Drive critical DRAM circuit design and timing closure for row, column paths, sensing, and datapath paths
• Develop and optimize architecture solutions for bandwidth, power, area, thermal, and reliability trade-offs
• Define and validate refresh, row-hammer mitigation, data-retention, and power-efficient operation schemes
• Lead architecture feasibility studies using transistor-level simulation and physical implementation analysis
• Develop HBM Architecture Reference Designs (ARD), including golden schematics, timing budgets, and verification methodology
• Collaborate with Array, Datapath, ECC, TSV, PDN, Layout, Verification, and DFT teams to drive end-to-end design execution
• Support silicon bring-up, characterization, failure analysis, and architecture-to-design handoff

Skills

HBM core-die architecture

DRAM circuit design

Architectural feasibility studies

Cross-functional collaboration

Problem-solving

Tools

HSPICE

Spectre

FineSim

PrimeSim

Job description

Micron Technology, Inc. is seeking an engineer to own HBM core-die architecture and critical DRAM circuit design, impacting bandwidth, power, area, and reliability. You will drive architecture definition, circuit feasibility, and ARD development for advanced 3D-stacked HBM products.

The role requires hands-on experience with SPICE-based tools and a track record of architecture decisions across cross-functional teams to deliver end-to-end design and silicon bring-up support.