DRAM Process Integration Engineer - 3D Memory R&D

Micron Technology, Inc.; Boise (ID); On-site; USD 42,000 - 64,000; Full time

Job summary

Micron Technology, Inc. in Boise requires a process integration engineer (PhD candidate) focused on 3D DRAM technology to improve device performance and manufacturability. You will work with cross-functional teams across development, design, and yield to solve complex integration challenges.

The role emphasizes experiments, data analysis, and collaboration, with the aim of advancing memory scaling and reliability in a cutting-edge 300mm R&D environment.

Qualifications

• Currently pursuing a PhD candidate in Materials Science and Electrical Engineering preferred but PhD in physics and chemical engineering acceptable.
• Must be a current student, and cannot graduate prior to September 2027
• Focus on semiconductor device fabrication, electrical and material characterization preferred.

Responsibilities

• Contribute to technology development activities to enable next generation DRAM, working on device components such as charge storage devices and thin-film transistors, among others.
• Optimize process flows and develop creative solutions to meet product requirements.
• Engage numerous cross-functional teams including process development, product engineering, design, probe, and yield enhancement to arrive at solutions for performance and yield issues.
• Design and run experiments in the R&D fab.
• Analyze inline, parametric, and probe data to evaluate operating and failure mechanisms, sources of noise and variability, and to apply fundamental principles for optimization of device performance and reliability.
• Summarize sophisticated problems, explain the actions necessary to address them, and drive the team to implement them.

Skills

Data analysis

Modeling

Collaboration

Semiconductor knowledge

Education

PhD candidate in Materials Science and Electrical Engineering

PhD in physics or chemical engineering acceptable

Job description

Micron Technology, Inc. in Boise requires a process integration engineer (PhD candidate) focused on 3D DRAM technology to improve device performance and manufacturability. You will work with cross-functional teams across development, design, and yield to solve complex integration challenges.

The role emphasizes experiments, data analysis, and collaboration, with the aim of advancing memory scaling and reliability in a cutting-edge 300mm R&D environment.