DRAM Process Integration Intern - Innovate in Memory Tech

Micron Technology, Inc

Boise (ID)

On-site

USD 42,000 - 54,000

Full time

14 days+
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Job summary

Micron Technology, Inc. in Boise, Idaho, invites PhD candidates to join our research team focused on next-generation DRAM technology.

You will contribute to device fabrication research, run experiments in the R&D fab, and work with cross-functional teams to optimize processes and improve device performance. We seek students who are pursuing a PhD in Materials Science, Electrical Engineering, or related fields and who cannot graduate before September 2027.

Qualifications

  • Currently pursuing a PhD; graduation after Sept 2027 required.
  • PhD in Materials Science and Electrical Engineering preferred; Physics/Chemical Engineering acceptable.
  • Focus on semiconductor device fabrication and electrical/material characterization preferred.

Responsibilities

  • Contribute to technology development for next-generation DRAM and device components.
  • Optimize process flows and develop solutions to meet product requirements.
  • Collaborate with cross-functional teams to address performance and yield issues.
  • Design and run experiments in the R&D fab.
  • Analyze inline, parametric, and probe data to evaluate operating and failure mechanisms.
  • Summarize complex problems and drive actions to implement solutions.

Skills

Data analysis
Modeling
Collaboration
Semiconductor industry interest

Education

PhD in Materials Science & Electrical Engineering
PhD in Physics & Chemical Engineering

Job description

Micron Technology, Inc. in Boise, Idaho, invites PhD candidates to join our research team focused on next-generation DRAM technology.

You will contribute to device fabrication research, run experiments in the R&D fab, and work with cross-functional teams to optimize processes and improve device performance. We seek students who are pursuing a PhD in Materials Science, Electrical Engineering, or related fields and who cannot graduate before September 2027.

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