Director, Advanced Packaging Process Integration

RediRecruit RPO Solutions; United States; On-site; USD 190,000 - 250,000; Full time

Job summary

RediRecruit RPO Solutions is hiring a Director, Process Integration & Development to lead advanced packaging process integration and development in the semiconductor industry. The role combines strategic leadership with hands-on engineering in a founding technical team.

The successful candidate will oversee patterning, bonding, and CMP, travel 50%+ internationally, and contribute to AI and HPC technologies, with a base salary and equity/bonus described.

Qualifications

• 8+ years of semiconductor experience.
• Expertise in advanced packaging, process integration and development.
• Experience with patterning, bonding and CMP.
• Ability to travel 50%+ internationally.

Responsibilities

• Lead semiconductor packaging process integration and development.
• Drive process development across patterning, bonding, and CMP.
• Solve complex integration challenges from investigation to validation.
• Build and lead technical teams with hands-on process ownership.
• Support technology validation, manufacturing readiness, and yield improvements.
• Collaborate with partners, equipment suppliers, and research teams.

Skills

Semiconductor packaging

Process integration

Technical leadership

Technology development

Education

Master's or PhD in Materials Science, Electrical Engineering, Chemical Engineering, Mechanical Engineering, Physics

Tools

Patterning equipment

Bonding equipment

CMP equipment

Job description

RediRecruit RPO Solutions is hiring a Director, Process Integration & Development to lead advanced packaging process integration and development in the semiconductor industry. The role combines strategic leadership with hands-on engineering in a founding technical team.

The successful candidate will oversee patterning, bonding, and CMP, travel 50%+ internationally, and contribute to AI and HPC technologies, with a base salary and equity/bonus described.