Senior Director, Advanced Packaging Process Integration

Micron Technology, Inc.; Boise (ID); On-site; USD 180,000 - 240,000; Full time

Benefits offered by this job

Medical, dental and vision plans

Paid time off

Paid holidays

Job summary

Micron Technology, Inc. seeks a Process Integration Lead for Advanced Packaging to guide a team from concept to full-scale manufacturing of 2.5D/3D packaging platforms. You will drive technology development, process integration, and cross-functional collaboration with design, equipment, reliability, and test groups.

You will mentor a high-skilled team while shaping the technology roadmap for next-generation packaging platforms and ensuring successful technology transfer to manufacturing.

Qualifications

• Bachelor’s degree in Materials/Chemical Engineering or related field with 15+ years experience in advanced packaging development.
• Experience with 2.5D/3D stacking, HBM integration, interconnects, underfill, molding, bonding.
• Experience with AI-enabled engineering workflows and automation in semiconductor development.

Responsibilities

• Lead a team for seamless process integration across 2.5D and 3D packaging platforms.
• Develop, optimize, and qualify emerging packaging technologies.
• Improve yield and reliability via defect analysis and data-driven root cause investigation.
• Lead technology transfer from development to manufacturing and coordinate cross-functional teams.
• Warpage modeling and inline metrology validation.

Skills

Team leadership

Advanced packaging development

DOE design of experiments

Data-driven root cause analysis

AI-enabled engineering workflows

Education

Bachelor’s degree in Materials/Chemical Engineering

Master’s degree or PhD (preferred)

Tools

2.5D packaging

3D stacking

HBM integration

TSVs

Hybrid bonding

Job description

Micron Technology, Inc. seeks a Process Integration Lead for Advanced Packaging to guide a team from concept to full-scale manufacturing of 2.5D/3D packaging platforms. You will drive technology development, process integration, and cross-functional collaboration with design, equipment, reliability, and test groups.

You will mentor a high-skilled team while shaping the technology roadmap for next-generation packaging platforms and ensuring successful technology transfer to manufacturing.