Senior Applications Engineer — Advanced Packaging

Confidential

Missouri

Sur place

USD 140 000 - 190 000

Plein temps

Il y a 2 jours

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Relocation assistance

Résumé du poste

Confidential is seeking a Principal Applications Engineer to join a next-generation Advanced Packaging team, based on-site in Missouri. This hands-on technical leadership role supports cutting-edge packaging technologies for customers in the semiconductor industry.

You will lead applications engineering, drive process integration, and provide technical leadership on wafer bonding, RDL, and hybrid bonding. Collaboration with process, equipment, and customer teams will be essential to optimize

Qualifications

Bachelor's degree in Engineering, Materials Science, or a related field.
Strong background in advanced packaging and process integration.
Experience with OSAT, foundry, IDM, or semiconductor equipment companies.

Responsabilités

Lead applications engineering and process integration for advanced packaging platforms.
Provide technical leadership on wafer bonding/debonding, RDL, WLP/PLP, and hybrid bonding processes.
Collaborate with process, equipment, and customer teams to troubleshoot and optimize performance.
Support lithography and photolithography within advanced packaging flows.
Serve as a key technical resource for customer engagements and next-generation technology development.