Principal Application Engineer

Confidential; Missouri; On-site; USD 140,000 - 190,000; Full time

Benefits offered by this job

Relocation assistance

Job summary

Confidential is seeking a Principal Applications Engineer to join a next-generation Advanced Packaging team, based on-site in Missouri. This hands-on technical leadership role supports cutting-edge packaging technologies for customers in the semiconductor industry.

You will lead applications engineering, drive process integration, and provide technical leadership on wafer bonding, RDL, and hybrid bonding. Collaboration with process, equipment, and customer teams will be essential to optimize

Qualifications

• Bachelor's degree in Engineering, Materials Science, or a related field.
• Strong background in advanced packaging and process integration.
• Experience with OSAT, foundry, IDM, or semiconductor equipment companies.

Responsibilities

• Lead applications engineering and process integration for advanced packaging platforms.
• Provide technical leadership on wafer bonding/debonding, RDL, WLP/PLP, and hybrid bonding processes.
• Collaborate with process, equipment, and customer teams to troubleshoot and optimize performance.
• Support lithography and photolithography within advanced packaging flows.
• Serve as a key technical resource for customer engagements and next-generation technology development.

Skills

Advanced packaging

Wafer bonding

RDL

WLP/PLP

Hybrid bonding

Lithography

Cross-functional leadership

Education

Bachelor's degree in Engineering or Materials Science

Tools

Lithography tools

Job description

We're looking for a Principal Applications Engineer to join a next-generation Advanced Packaging team. This is a hands‑on technical leadership role supporting cutting‑edge packaging technologies for customers in the semiconductor industry.

About the Company

Our client is a well‑established player in the semiconductor industry, developing equipment and process solutions for next‑generation advanced packaging technologies. They partner with major foundries, OSATs, and IDMs worldwide to advance the state of the art in chip packaging and heterogeneous integration.

What You'll Do

• Lead applications engineering and process integration efforts for advanced packaging platforms
• Provide technical leadership on wafer bonding/debonding, RDL, WLP/PLP, and hybrid bonding processes
• Partner cross‑functionally with process, equipment, and customer engineering teams to troubleshoot and optimize process performance
• Support lithography and photolithography process integration within advanced packaging flows
• Serve as a key technical resource for customer engagements, escalations, and next‑gen technology development

What You Bring

• Strong background in advanced packaging, wafer bonding/debonding, RDL, WLP/PLP, hybrid bonding, or related process integration disciplines
• Experience with lithography/photolithography process steps a strong plus
• Prior experience at a leading OSAT, foundry, IDM, or semiconductor equipment/materials company
• Bachelor's degree or higher in Engineering, Materials Science, or related field, with significant relevant industry experience
• Strong communication and cross‑functional leadership skills

Location

• This role is based on-site in Missouri; relocation assistance is available for the right candidate.

Work Authorization

• No visa sponsorship is available at this time, and none will be available in the future for this role. Candidates must be authorized to work in the U.S. without current or future sponsorship.