Senior Process Engineering Director, Advanced Packaging

ASM International; United States; On-site; USD 150,000 - 200,000; Full time

Job summary

A leading technology firm in the United States seeks a Senior Member of Technical Staff / Director, Process Engineering, who will drive the development of high-thermal-conductivity thin films for advanced packaging. The successful candidate will lead a team, align on roadmaps with customers, and leverage expertise in semiconductor technologies. A Ph.D. and significant industry experience are required. This role includes collaboration in a global R&D setting and offers a chance to push the boundaries of innovation in high-performance computing.

Qualifications

• 10–15+ years in semiconductor industry with technical leadership.
• Ability to work in a fast-paced environment.
• Strong collaborative skills in global R&D.

Responsibilities

• Lead a team of engineers focused on high thermal conductivity thin films.
• Define and drive development aligned to customer requirements.
• Collaborate with R&D and customers to align on materials roadmaps.

Skills

Expertise in ALD/PEALD

Deep understanding of semiconductor device physics

Proven track record in process innovation

Excellent communication skills in English

Education

Ph.D. in Physics, Chemistry, or related field

Tools

CVD/PECVD

Job description

A leading technology firm in the United States seeks a Senior Member of Technical Staff / Director, Process Engineering, who will drive the development of high-thermal-conductivity thin films for advanced packaging. The successful candidate will lead a team, align on roadmaps with customers, and leverage expertise in semiconductor technologies. A Ph.D. and significant industry experience are required. This role includes collaboration in a global R&D setting and offers a chance to push the boundaries of innovation in high-performance computing.