Senior Director, Advanced Packaging Process Integration

1000 Micron Technology, Inc.; Idaho City (ID); On-site; USD 180,000 - 240,000; Full time

Benefits offered by this job

Medical, dental and vision plans

Paid time off and holidays

Paid family leave

Benefits guide available

Job summary

Micron Technology, Inc. is seeking a Process Integration Lead for Advanced Packaging to head a team driving 2.5D/3D packaging and HBM integration from concept through manufacturing.

You will shape roadmaps, mentor engineers, and deliver high-performance multi-die solutions across global operations. You will lead technology transfer, DOE-driven development, and collaboration across design, process, equipment, reliability, and test teams, ensuring robust qualification and scalable processes for

Qualifications

• Bachelor’s degree in Materials, Chemical Engineering, or related field with 15+ years in advanced packaging.
• Experience with 2.5D/3D stacking, HBM integration, and interconnects.
• Experience leading teams and driving large engineering programs to completion.

Responsibilities

• Manage and grow a team for seamless process integration across 2.5D/3D packaging platforms.
• Develop, optimize, and qualify emerging packaging technologies via DOE and validation.
• Improve yield and reliability using defect analysis and data-driven root cause investigations.
• Lead technology transfer from development to manufacturing, including qualification.
• Collaborate with design, process, equipment, reliability, test, and manufacturing teams.
• Warpage engineering: modeling, mitigation, and inline metrology validation.

Skills

Team leadership

Advanced packaging

DOE experiments

2.5D/3D packaging

AI-enabled workflows

Cross-functional collaboration

Education

Bachelor’s in Materials/Chemical Eng

Master’s or PhD preferred

Tools

SPC software

DOE methods

Statistical analysis

Job description

Micron Technology, Inc. is seeking a Process Integration Lead for Advanced Packaging to head a team driving 2.5D/3D packaging and HBM integration from concept through manufacturing.

You will shape roadmaps, mentor engineers, and deliver high-performance multi-die solutions across global operations. You will lead technology transfer, DOE-driven development, and collaboration across design, process, equipment, reliability, and test teams, ensuring robust qualification and scalable processes for