Process Integration Development Manager - Advanced Packaging

RediRecruit RPO Solutions; United States; On-site; USD 190,000 - 250,000; Full time

Job summary

RediRecruit RPO Solutions is hiring a Director, Process Integration & Development to lead advanced packaging process integration and development in the semiconductor industry. The role combines strategic leadership with hands-on engineering in a founding technical team.

The successful candidate will oversee patterning, bonding, and CMP, travel 50%+ internationally, and contribute to AI and HPC technologies, with a base salary and equity/bonus described.

Qualifications

• 8+ years of semiconductor experience.
• Expertise in advanced packaging, process integration and development.
• Experience with patterning, bonding and CMP.
• Ability to travel 50%+ internationally.

Responsibilities

• Lead semiconductor packaging process integration and development.
• Drive process development across patterning, bonding, and CMP.
• Solve complex integration challenges from investigation to validation.
• Build and lead technical teams with hands-on process ownership.
• Support technology validation, manufacturing readiness, and yield improvements.
• Collaborate with partners, equipment suppliers, and research teams.

Skills

Semiconductor packaging

Process integration

Technical leadership

Technology development

Education

Master's or PhD in Materials Science, Electrical Engineering, Chemical Engineering, Mechanical Engineering, Physics

Tools

Patterning equipment

Bonding equipment

CMP equipment

Job description

Compensation : $190,000–$250,000 base salary + Equity & Bonus

We are hiring Director, Process Integration & Development , an innovative technology company working at the forefront of advanced semiconductor packaging and heterogeneous integration .

This is an exciting opportunity for a senior semiconductor professional to join a founding technical team, lead critical process development initiatives, and contribute to next-generation technologies supporting AI and high-performance computing.

About the Role:

The successful candidate will lead advanced packaging process integration and development while remaining hands-on with laboratory work, process optimization, and technical problem-solving.

Key Responsibilities:

• Lead semiconductor packaging process integration and development.
• Drive process development across **patterning, bonding, and CMP**.
• Solve complex integration challenges independently, from investigation through validation.
• Build and lead technical teams while maintaining hands-on process ownership.
• Support technology validation, manufacturing readiness, and yield improvement.
• Collaborate with technical partners, equipment suppliers, and research teams.

What We're Looking For:

• Typically 8+ years of relevant semiconductor experience.
• Strong hands-on expertise in advanced packaging, process integration, and development.
• Direct experience with patterning, bonding technologies, and CMP.
• Proven technical leadership with a hands-on approach.
• Experience in hybrid bonding, chiplets, 2.5D/3D integration, or related technologies is an advantage.
• Existing U.S. work authorization is required.
• Ability to undertake 50%+ international travel, including potential extended stays abroad.

Education:

A master's or PhD in Materials Science, Electrical Engineering, Chemical Engineering, Mechanical Engineering, Physics, or a related field is listed in the original job description.

Why Consider This Opportunity?

• Join a founding technical team.
• Combine strategic leadership with hands-on engineering.
• Receive a competitive base salary alongside equity and bonus opportunities.