ASIC Package Design Intern — Hybrid Co-op

Advanced Micro Devices, Inc.; Boxborough (MA); Hybrid; USD 28,000 - 41,000; Full time

Job summary

Advanced Micro Devices, Inc. is seeking an ASIC Package Engineering intern/co-op to join our team and work with engineers to bring new packaging technology to reality. You will help with substrate, interposer and bump designs for AMD products, test vehicles, and probe cards.

You will learn design verification, yield analysis and material benchmarking while collaborating with partners to achieve cost-efficient, high-performance designs.

Qualifications

• Enrolled in a US university pursuing a relevant Bachelor's degree.
• Interest in ASIC packaging, substrate/interposer and bump designs.
• Interest in data analytics and visualization with PowerBI.

Responsibilities

• Support package design and development engineers in prioritizing and optimizing new projects.
• Assist with substrate, interposer and bump designs for AMD products and test vehicles.
• Contribute to design verification to ensure performance and quality.
• Analyze yield and defects to improve design performance and yield.
• Evaluate materials and interact with partners for cost-efficient designs.

Skills

ASIC packaging

Python

Perl

SQL

PowerBI

Education

Bachelor's in Electrical Engineering / related field

Tools

Package design software

PCB design software

Job description

Advanced Micro Devices, Inc. is seeking an ASIC Package Engineering intern/co-op to join our team and work with engineers to bring new packaging technology to reality. You will help with substrate, interposer and bump designs for AMD products, test vehicles, and probe cards.

You will learn design verification, yield analysis and material benchmarking while collaborating with partners to achieve cost-efficient, high-performance designs.