ASIC Package Engineering Intern – Innovate in Packaging

AMD; Santa Clara (CA); Hybrid; USD 34,000 - 48,000; Full time

Job summary

AMD invites students for Spring/Summer Co-op or Summer Internship roles in San Jose/Santa Clara, CA. You’ll join packaging design teams onsite or hybrid, contributing to design development and testing across AMD products and AI initiatives.

You’ll learn substrate/interposer/bump design, perform verification tasks, analyze yields, and collaborate with cross-functional partners to achieve cost-efficient, high-yield packaging solutions. This role runs through 2027.

Qualifications

• Enrolled in a US university pursuing a Bachelor’s degree in Electrical/Engineering or related field.
• Knowledge of scripting languages (Python/Perl/SQL).
• Experience with data analytics and visualization tools like PowerBI.

Responsibilities

• Support package design and development engineers on prioritizing and optimizing projects.
• Assist in substrate, interposer and bump designs for AMD products and test vehicles.
• Contribute to design verification efforts and improve yield and performance.

Skills

Python

Perl

SQL

PowerBI

Education

Bachelor's degree student (US) in Electrical/Engineering/related

Tools

Package design software

Silicon/PCB design software

Job description

AMD invites students for Spring/Summer Co-op or Summer Internship roles in San Jose/Santa Clara, CA. You’ll join packaging design teams onsite or hybrid, contributing to design development and testing across AMD products and AI initiatives.

You’ll learn substrate/interposer/bump design, perform verification tasks, analyze yields, and collaborate with cross-functional partners to achieve cost-efficient, high-yield packaging solutions. This role runs through 2027.