ASIC Package Engineering Co-op - Shape Next-Gen Packaging

AMD; Austin (TX); Hybrid; USD 34,000 - 44,000; Full time

Job summary

AMD in Austin, TX is seeking a motivated ASIC Package Engineering intern/co-op to join our team and help bring advanced packaging technology to reality while you learn from a team of engineers. You'll support package design, interposer and bump design, verification, and yield analysis, with opportunities to benchmark materials and collaborate with partners for cost-effective, high-yield solutions.

This role requires enrollment in a US university in relevant engineering degree; full-time

Qualifications

• Enrolled in a US-based university pursuing a bachelor's degree in Electrical Engineering or related field.
• Interest in ASIC packaging, interposer and bump design.
• Familiarity with package design software and scripting basics.

Responsibilities

• Assist package design and development engineers in prioritizing projects.
• Learn substrate, interposer and bump designs for AMD products and test vehicles.
• Support design verification to ensure performance and quality.
• Analyze yield and defect metrics to improve design yield.
• Evaluate packaging materials and collaborate with partners for cost efficiency.

Skills

Electrical Engineering

PowerBI

Scripting (Perl/Python/SQL)

Education

Bachelor's degree in Electrical Engineering or related field

Tools

Package design software

Substrate/Interposer design

Bump design tools

Job description

AMD in Austin, TX is seeking a motivated ASIC Package Engineering intern/co-op to join our team and help bring advanced packaging technology to reality while you learn from a team of engineers. You'll support package design, interposer and bump design, verification, and yield analysis, with opportunities to benchmark materials and collaborate with partners for cost-effective, high-yield solutions.

This role requires enrollment in a US university in relevant engineering degree; full-time