ASIC Package Eng Co-op/Intern — Hybrid, 40h/wk

AMD; Fort Collins (CO); Híbrido; USD 23.000 - 30.000; Jornada completa

Descripción de la vacante

AMD in Fort Collins, CO seeks an intern/co-op in packaging design to support engineers on prioritizing and optimizing projects. You will contribute to substrate, interposer and bump design work on AMD products and test vehicles with guided projects across design verification and yield improvement.

This hands-on role exposes you to evaluating packaging materials, collaborating with partners for cost-efficient designs, and developing skills in silicon and PCB packaging processes within a mentoring

Formación

• Enrolled in a US-based university for a Bachelor's in EE/Engineering.
• Knowledge of package, silicon, or PCB design software.
• Experience with scripting languages (Perl/Python/SQL) and data analytics tools.

Responsabilidades

• Support Package design and Development Engineers in prioritizing and optimizing new projects.
• Train to complete substrate, interposer and bump designs for AMD products, test vehicles and probe card substrates.
• Engage in design verification implementation to ensure performance, quality and efficiency.
• Analyze yield and defect metrics to ensure design performance and help improve yield.
• Evaluate and benchmark packaging materials and interact with partners for cost-efficient design and materials.

Conocimientos

Perl

Python

SQL

Data analytics

Educación

Bachelor's degree in Electrical Engineering / Engineering Science / Computer Engineering / Mechanical Engineering / Materials Science Engineering

Herramientas

Package design software

PCB design software

Descripción del empleo

AMD in Fort Collins, CO seeks an intern/co-op in packaging design to support engineers on prioritizing and optimizing projects. You will contribute to substrate, interposer and bump design work on AMD products and test vehicles with guided projects across design verification and yield improvement.

This hands-on role exposes you to evaluating packaging materials, collaborating with partners for cost-efficient designs, and developing skills in silicon and PCB packaging processes within a mentoring